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Flexible film chip carrier with decoupling capacitors

  • US 4,744,008 A
  • Filed: 09/11/1987
  • Issued: 05/10/1988
  • Est. Priority Date: 11/18/1986
  • Status: Expired due to Term
First Claim
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1. An electronic packaging structure comprising:

  • a second level electronic package having one opening therein for accommodating a semiconductor chip and having circuitry for electrical connection to the semiconductor chip; and

    a circuitized thin film structure having a semiconductor chip mounted on one side of the thin-film structure and at least one decoupling capacitor mounted on an opposite side of the thin-film structure which is electrically connected to input/output contacts of said semiconductor chip, said thin-film structure is mounted on the second level electronic package with the semiconductor chip positioned in the opening of the second level package and with the circuitry on said thin-film structure connected to the circuitry on the second level electronic package to electrically interconnect the input/output contacts of said semiconductor chip to the circuitry on the second level electronic package.

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