Endoscope using a chip carrier type solid state imaging device

• US 4,745,470 A
• Filed: 04/03/1987
• Issued: 05/17/1988
• Est. Priority Date: 04/04/1986
• Status: Expired due to Term

• Current Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Original Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Inventors: Eino, Teruo, Yabe, Hisao
• Primary Examiner(s): Britton, Howard W.
• Assistant Examiner(s): Kostak, Victor R.
• Application Number:
  US07/033,954
• Time in Patent Office: 410 Days
• Field of Search: 358/98, 358/229, 128/4, 128/6
• US Class Current: 348/76
• CPC Class Codes: A61B 1/00096 Optical elements
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: G02B 23/2423 of the distal end
• CPC Class Codes: G02B 23/2484 Arrangements in relation to a camera or imaging device processing or control of video signals generated by an endoscope H04N23/60, H04N23/70
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/66 Remote control of cameras or camera parts, e.g. by remote control devices

Abstract

A solid state imaging device and a substrate to which this solid state imaging device is fitted is contained in the tip part of an endoscope. Conductive parts are formed on at least one side surface of the substrate. The positions of the conductive parts, when that the conductive parts are overlapped with the solid state imaging device, are retreated to be within the electrode positions of the solid state imaging device so that the imaging device may be contained in a small space.

Claims

1. An endoscope having:

an image forming objective system contained in the tip part of an insertion part formed to be elongate so as to be insertable into a body cavity or the like;

a solid state imaging device having a photoelectric converting function and arranged so as to have its imaging surface located in the focal plane of said objective system; and

a substrate having said solid state imaging device fixed thereon and having conductive parts electrically connected with the electrodes of said solid state imaging device,

characterized in that said conductive parts are formed on at least one side surface of said substrate and said solid state imaging device is fitted onto said substrate while, for electrodes located on at least one end surface side in said solid state imaging device placed on said substrate so as to be adjacent to said conductive parts, one side surface of said conductive parts retreats to be below the same level as of said electrode position.

2. An endoscope according to claim 1 wherein the plate surface of said solid state imaging device is arranged substantially parallel with the long axis direction of the endoscope, the wire bonding part of said solid state imaging device is formed on an end side intersecting substantially at right angles with the long axis direction of the endoscope and at least a part of the electrodes of the solid state imaging device are formed substantially along the long axis direction of the endoscope.

3. An endoscope according to claim 1 or 2 wherein the electrodes of said solid state imaging device are provided on the lower surface of the base of said solid state imaging device and the electrodes on the lower surface of the base of said solid state imaging device and the conductive parts of said substrate are electrically connected with each other.

4. An endoscope according to claim 1 or 2 wherein the width of the conductive part forming direction in the substrate of said solid state imaging device is larger than the width of the conductive part forming direction of said substrate.

5. An endoscope according to claim 1 or 2 wherein electronic parts are fitted on the substrate in the part arranged as projected from the side of said solid state imaging device.

6. An endoscope according to claim 5 wherein the imaging surface of said solid state imaging device is positioned in a plane including the diameter substantially passing through the center axis of the endoscope.

7. An endoscope according to claim 6 wherein the conductive parts formed on at least one side surface of said substrate are plural and an insulating part for preventing short-circuiting is formed to project between the adjacent conductive parts.

8. An endoscope according to claim 6 wherein the center position of said imaging surface is arranged to be eccentric to one side from said center axis and a light guide forming an illuminating means is arranged on the other side.

9. An endoscope according to claim 1 wherein said substrate is formed of a multilayered ceramic substrate.

10. An endoscope according to claim 1 wherein said solid state imaging device is formed of a multilayered ceramic substrate.

11. An endoscope according to claim 1 wherein said substrate is formed of a multilayered ceramic substrate and said solid state imaging device is formed of a multilayered ceramic substrate.

12. An endoscope according to claim 10 wherein the pitch between the adjacent electrodes connected at the other ends with the bonding pads of a solid state imaging device chip by using said multilayered ceramic substrate and connected with the substrate side is made larger than the pitch of the bonding pads of said solid state imaging device chip.

13. An endoscope according to claim 10 wherein the electrodes to be connected with the substrate side are arranged as dispersed by using said multilayered ceramic substrate.

14. An endoscope according to claim 9 or 10 wherein said multilayered ceramic substrate is made a step shorter in the substrate part on the side near the outer periphery of the tip part.

15. An endoscope according to claim 1 wherein said solid state imaging device has the parts to which a solid state imaging device chip is die-bonded and the electrode parts formed of the same metal plates.

16. An endoscope according to claim 1 wherein the electrodes of said solid state imaging device are provided on the lower surface of the base of said solid state imaging device and the electrodes on the lower surface of the base of said solid state imaging device and the conductive parts of said substrate are electrically connected with each other and wherein the width of the conductive part forming direction in the substrate of said solid state imaging device is larger than the width of the conductive part forming direction of said substrate.

17. An endoscope according to claim 2 where the electrodes of said solid state imaging device are provided on the lower surface of the base of said solid state imaging device and the electrodes on the lower surface of the base of said solid state imaging device and the conductive parts of said substrate are electrically connected with each other and wherein the width of the conductive part forming direction in the substrate of said solid state imaging device is larger than the width of the conductive part forming direction of said substrate.

18. An endoscope according to claim 16 wherein electronic parts are fitted on the substrate in the part arranged as projected from the side of said solid state imaging device.

19. An endoscope according to claim 17 wherein electronic parts are fitted on the substrate in the part arranged as projected from the side of said solid state imaging device.

20. An endoscope according to claims 16, 17, 18, or 19 wherein the imaging surface of the solid state imaging device is positioned in a plane including the diameter substantially passing through the center axis of the endoscope and wherein the conductive parts formed on at least one side surface of said substrate are plural and an insulating part for preventing shortcircuiting is formed to project between the adjacent conductive parts.

21. An endoscope having:

an image forming objective system contained in the tip part of an insertion part formed to be elongate so as to be insertable into a body cavity or the like;

a solid state imaging device having a photoelectric converting function and arranged so as to have its imaging surface located in the focal plane of said objective system; and

a substrate having said solid state imaging device fixed thereon and having conductive parts electrically connected with the electrodes of said solid state imaging device,

wherein said solid state imaging device comprises;

a base member having conductive parts;

a solid state imaging device chip die-bonded on said base member;

a transparent plate pasted to cover the imaging surface of said solid state imaging device chip;

bonding wires connecting both bonding pads of said solid state imaging device chip and said base member; and

a non-transparent resin sealing the connecting parts through said bonding wires in the side parts of said transparent plate.

22. An endoscope according to claim 21 wherein a color filter array is interposed between said solid state imaging device chip and said transparent plate.