Method for producing an identification card with an integrated circuit

• US 4,746,392 A
• Filed: 09/22/1986
• Issued: 05/24/1988
• Est. Priority Date: 12/28/1982
• Status: Expired due to Term

• Current Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Original Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Inventors: Hoppe, Joachim
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Hoch, Ramon R.
• Application Number:
  US06/910,351
• Time in Patent Office: 610 Days
• Field of Search: 156/145, 156/146, 156/244.12, 156/293, 156/295, 156/303.1, 156/299, 283/83, 283/904, 29/841, 29/827, 264/272.17, 264/279.1, 357/72, 235/492, 235/488, 427/96, 40/630, 40/625
• US Class Current: 156/244.12
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

Claims

1. A method of producing an identification card including an IC module comprising the steps of:

(a) providing an IC module mounted on a carrier element;

(b) providing at least one identification card layer with a recess layer in dimension than said IC module;

(c) suspending said IC module within said recess so that empty space exists substantially completely around said IC module in said recess; and

(d) introducing an amount of polymer material having a consistency which ranges from pasty to liquid and being capable of cross-linking to form a solid elastomeric material into said recess so as to fill said empty space around said IC module thereby resulting with a completely encased IC module;

prior to

(e) applying a cover film to said identification card layer; and

(f) subjecting such cover film and at least one identification card layer to laminating heat and pressure to form a laminated identification card layer construction and to permit said polymer to cross-link only during or after the laminating process and form into a solid elastomeric material whereby an identification card is produced having substantially flat surfaces essentially devoid of deformations in the area of the IC module.

2. The method in accordance with claim 1 further comprising providing a cavity remote from said recess and a channel in communication between said cavity and said recess within said layer of construction.

3. The method in accordance with claim 2 wherein said at least one card layer comprises a first layer and a second layer, said recess being formed in said first layer and said second layer and said cavity and said channel being formed in said second layer.

4. The method in accordance with claim 1 further comprising providing said cover film with a magnetic strip located in the area of said IC module.

5. The method in accordance with claim 1 wherein said polymer is a silicon rubber composition.