Apparatus for cooling integrated circuit chips with forced coolant jet

• US 4,750,086 A
• Filed: 12/11/1985
• Issued: 06/07/1988
• Est. Priority Date: 12/11/1985
• Status: Expired due to Fees

• Current Assignee: Unisys Corporation
• Original Assignee: Unisys Corporation
• Inventors: Mittal, Faquir C.
• Primary Examiner(s): Tolin, G. P.
• Assistant Examiner(s): SALATA, ANTHONY J
• Application Number:
  US06/807,713
• Time in Patent Office: 909 Days
• Field of Search: 165/80.4, 165/908, 357/82, 361/382, 361/383, 361/385-388, 174/15 R, 174/16 HS
• US Class Current: 361/689
• CPC Class Codes: H01L 23/4332 Bellows
• CPC Class Codes: H01L 23/4336 in combination with jet impingement
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 165/908 Fluid jets

Abstract

The capability of the microbellows cooling technique to remove heat from multi-chip modules is enhanced with a highly conductive, rigid, heat spreader. The heat spreader has a planar surface urged against a planar surface of the chip by the flexible microbellows. The surface area of the heat spreader is greater than the mating surface area of the chip. The heat spreader is attached to the bottom surface of the microbellows. The surface area of the heat spreader which mates with the surface of the chip is highly polished and coated with a highly conductive soft metal. A jet of coolant is forced into the inner surface of the microbellows.

Claims

1. An apparatus which cools integrated circuit chips comprising:

a housing including a chamber therein and a board having said chips mounted thereon, each chip extending into said chamber and having a substantially planar surface defining a first surface area;

a plurality of flexible heat conducting microbellows supported in said housing and each having a planar heat receiving end adjacent a respective one of said chips;

a plurality of rigid heat spreaders which each have a planar surface connected to said heat receiving end of a respective microbellows, each heat spreader having another planar surface defining a second polished and metal coated surface area greater than said first surface area of a respective chip, said second surface area of each heat spreader being in planar contact with said first surface area of a respective chip;

means for conducting a fluid coolant into each microbellows, said conducting means being supported in said chamber and having respective open ends extending into each microbellows such that they are spaced apart and detached from the heat receiving end; and

,

each open end being shaped as a nozzle which discharges a high velocity jet of said fluid coolant directly onto the corresponding microbellows heat receiving end to cool the corresponding heat spreader and compress it against a chip.

2. The apparatus of claim 1 wherein each heat spreader is formed of a heat conductive, electrically insulative metal.

3. The apparatus of claim 1 wherein each heat spreader has a thickness of from about 0.025 inches to about 0.035 inches.

4. The apparatus of claim 1 wherein each heat spreader is connected to said microbellows by a solder.

5. The apparatus of claim 1 wherein each heat spreader is connected to said microbellows by a heat conductive, thermally insulative adhesive.

6. The apparatus of claim 1 wherein each second surface area is coated with a heat conductive, electrically insulative metal different from the metal of each heat spreader.

7. The apparatus of claim 1 including:

means for moving said fluid coolant into each microbellows, said moving means including a pump and a heat exchanger.

8. The apparatus of claim 1 wherein said chamber includes an inert fluid therein.

9. An apparatus which cools an integrated circuit chip comprising:

a conduit means for carrying a fluid coolant along a predetermined path to and from said chip;

said conduit means including a flexible member which forms a portion of said path for said coolant;

said flexible member having a heat receiving end with a heat spreader attached thereto, and said heat spreader having a surface in contact with said chip;

a nozzle inside of said flexible member and in close proximity to said heat receiving end but detached therefrom;

said nozzle being shaped to discharge a jet of said fluid coolant against said heat receiving end of said flexible member which in turn cools said heat spreader and compresses it against said chip.