Radiation attenuation shielding

• US 4,751,110 A
• Filed: 07/14/1986
• Issued: 06/14/1988
• Est. Priority Date: 07/14/1986
• Status: Expired due to Fees

• Current Assignee: Shipley Company, Inc.
• Original Assignee: Shipley Company, Inc.
• Inventors: Gulla, Michael, Benjamin, Terrell A., Farsi, Mark
• Primary Examiner(s): Silverberg, Sam
• Application Number:
  US06/885,468
• Time in Patent Office: 701 Days
• Field of Search: 427/305, 427/438, 427/405
• US Class Current: 427/305
• CPC Class Codes: C23C 18/50 with alloys based on iron, cobalt or nickel
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 3/24 Reinforcing the conductive pattern by solder coating H05K3/3457

Abstract

An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Claims

1. A method for formation of an electromagnetic radiation attenuating coating, said method consisting essentially of the steps of immersing a catalyzed dielectric surface in

a. a first electroless plating solution capable of depositing an electroless ally coating of copper, a member selected from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus, said coating having a predominant proportion of copper, and

b. without acitivating the first electroless alloy coating so formed, immersing said plated dielectric surface in a second electroless plating solution capable of depositing an electroless alloy coating of copper, a member sleected from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus, said coating having a predominant proportion of the member selected from the group of nickel, cobalt and mixtures.

2. The method of claim 1 where the first electroless plating solution is one that deposits an alloy coating having a copper concentration of at least 70 weight percent of the total alloy with the member from the group of nickel, cobalt and mixtures thereof and phosphorus comprising the balance of the alloy.

3. The method of claim 1 where the copper concentration varies between 90 and 95 weight percent of the coating.

4. The method of claim 1 where the second electroless plating solution is one that deposits an alloy coating having a concentration of a member from the group of nickel, cobalt and mixtures thereof having a concentration of at least 60 weight percent of the total alloy with the copper and phosphorus comprising the balance of the alloy.

5. The method of claim 4 where the member is nickel in a concentration that varies between 60 and 95 weight percent of the coating.

6. The method of claim 1 where the immersion time is sufficient to produce a coating of a thickness capable of attenuating 99% of the generated electromagnetic radiation.

7. The process of claim 1 including a step of forming a chrome conversion coating on the deposit from the second electroless plating solution by immersion in a chrome ion containing solution.