Radiation attenuation shielding
First Claim
1. A method for formation of an electromagnetic radiation attenuating coating, said method consisting essentially of the steps of immersing a catalyzed dielectric surface ina. a first electroless plating solution capable of depositing an electroless ally coating of copper, a member selected from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus, said coating having a predominant proportion of copper, andb. without acitivating the first electroless alloy coating so formed, immersing said plated dielectric surface in a second electroless plating solution capable of depositing an electroless alloy coating of copper, a member sleected from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus, said coating having a predominant proportion of the member selected from the group of nickel, cobalt and mixtures.
1 Assignment
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Accused Products
Abstract
An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.
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Citations
7 Claims
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1. A method for formation of an electromagnetic radiation attenuating coating, said method consisting essentially of the steps of immersing a catalyzed dielectric surface in
a. a first electroless plating solution capable of depositing an electroless ally coating of copper, a member selected from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus, said coating having a predominant proportion of copper, and b. without acitivating the first electroless alloy coating so formed, immersing said plated dielectric surface in a second electroless plating solution capable of depositing an electroless alloy coating of copper, a member sleected from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus, said coating having a predominant proportion of the member selected from the group of nickel, cobalt and mixtures.
Specification