Platen arrangement for hot melt ink jet apparatus

• US 4,751,528 A
• Filed: 09/09/1987
• Issued: 06/14/1988
• Est. Priority Date: 09/09/1987
• Status: Expired due to Term

• Current Assignee: Spectra Inc (Fujifilm Holdings Corporation)
• Original Assignee: Spectra Inc (Fujifilm Holdings Corporation)
• Inventors: Spehrley, Charles W. Jr., Schaffer, Robert R., Creagh, Linda T.
• Primary Examiner(s): Goldberg, E. A.
• Assistant Examiner(s): Reinhart, Mark
• Application Number:
  US07/094,664
• Time in Patent Office: 279 Days
• Field of Search: 346/140 PD, 346/140 R, 346/1.1, 346/ 76 PH, 400/126, 250/316.1, 250/319
• US Class Current: 347/18
• CPC Class Codes: B41J 11/00242 Controlling the temperature of the conduction means
• CPC Class Codes: B41J 11/00244 Means for heating the copy materials before or during printing
• CPC Class Codes: B41J 11/0085 Using suction for maintaining printing material flat on rotatable drums B41J13/226
• CPC Class Codes: B41J 11/02 Platens
• CPC Class Codes: B41J 2/17593 Supplying ink in a solid state

Abstract

In the particular embodiment described in the specification, a hot melt ink jet system includes a temperature-controlled platen provided with a heater and a thermoelectric cooler electrically connected to a heat pump and a temperature control unit for controlling the operation of the heater and the heat pump to maintain the platen temperature at a desired level. The apparatus also includes a second thermoelectric cooler to solidify hot melt ink in a selected zone more rapidly to avoid offset by a pinch roll coming in contact with the surface of the substrate to which hot melt ink has been applied. An airtight enclosure surrounding the platen is connected to a vacuum pump and has slits adjacent to the platen to hold the substrate in thermal contact with the platen.

Claims

1. Ink jet apparatus comprising an ink jet means for projecting ink at elevated temperature onto a substrate, platen means for supporting the substrate during operation of the ink jet means, and temperature control means for controlling the temperature of the platen means during operation including heat pump means for removing heat from the platen means so as to maintain a desired platen means temperature.

2. Apparatus according to claim 1, wherein the heat pump means includes thermoelectric cooler means in thermal contact with the platen means.

3. Apparatus according to claim 1, including electrical heater means responsive to the temperature control means for heating the platen means when the temperature of the platen means is below a desired level.

4. Apparatus according to claim 1, including pinch roll drive means for moving a substrate with respect to the ink jet means and the platen means and wherein the heat pump means includes second thermoelectric cooler means disposed in aligned relation with the pinch roll means in the direction of motion of the substrate to quench hot melt ink applied to a portion of a substrate prior to engagement by the pinch roll means.

5. Apparatus according to claim 1, including airtight housing means surrounding the platen means, vacuum pump means communicating with the interior of the airtight housing means, and aperture means provided in the airtight housing means for retaining a substrate in thermal contact with the platen means.

6. Apparatus according to claim 1, including heat sink means in thermal contact with the heat pump means to receive and dissipate heat therefrom.

7. Apparatus according to claim 6, wherein the heat sink means comprises a structural member supporting the platen means and including forced-air cooling means for cooling the heat sink means.

8. Apparatus according to claim 6, wherein the heat sink means is provided with fins to facilitate cooling of the heat sink means.

9. Apparatus according to claim 1, including system control means for controlling the operation of the ink jet means and responsive to a control signal from the temperature control means to change the rate of operation of the ink jet means.

10. Apparatus according to claim 1 wherein the platen means includes a curved platen surface and means for retaining the substrate in contact with the curved platen surface.

11. Apparatus according to claim 10 wherein the curved platen surface has a radius of curvature between about 5 and about 10 inches and extends at least about 10°

ahead of and 10°

after the location of the heat pump means.

12. Ink jet apparatus comprising ink jet means for projecting ink at elevated temperature onto a substrate, support means for supporting the substrate during operation of the ink jet means, and heat energy flux control means for controlling the heat energy flux into and out of the substrate so as to control the rate of solidification of ink after it has been projected onto the substrate.

13. Apparatus according to claim 12 including heat pump means for removing heat from the substrate support means in accordance with the substrate support means temperature.

14. Apparatus according to claim 12 including heating means for heating the substrate support means in accordance with the substrate support means temperature.

15. Apparatus according to claim 12 wherein the heat energy flux control means maintains the temperature of the support means at about 20°

to 30°

C. below the solidification temperature of the ink.

16. An ink jet printer system comprising ink jet means for directing drops of molten hot melt ink having a selected melting point toward a recording medium and heater means for heating the recording medium to a selected temperature below the melting point of the hot melt ink.

17. An ink jet printer system according to claim 16 where the selected temperature is about 20°

C. to 30°

C. below the melting point of the hot melt ink.

18. An ink jet printer system according to claim 16 wherein the melting point of the hot melt ink is approximately 60°

C.

19. An ink jet printer system according to claim 16 wherein the selected temperature is approximately 40°

C.