Edge finding in wafers

• US 4,752,898 A
• Filed: 01/28/1987
• Issued: 06/21/1988
• Est. Priority Date: 01/28/1987
• Status: Expired due to Term

• Current Assignee: Tencor Instruments (KLA Corporation)
• Original Assignee: Tencor Instruments (KLA Corporation)
• Inventors: Koenig, Franklin R.
• Primary Examiner(s): Smith, Jerry
• Assistant Examiner(s): NOT, DEFINED
• Application Number:
  US07/008,389
• Time in Patent Office: 510 Days
• Field of Search: 364/559, 364/468, 356/400, 198/394, 414/754, 414/757, 414/779, 414/786, 414/433
• US Class Current: 356/400
• CPC Class Codes: H01L 21/67796 with angular orientation of workpieces H01L21/67787 and H01L21/67793 take precedence
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: Y10S 414/136 including wafer orienting means
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

A system for finding the orientation of a substantially circular disk shaped wafer with at least one flat region on an edge thereof, in which the wafer is spun one 360 degree turn on a chuck and the edge position is measured by a linear array to obtain a set of data points at various wafer orientations. The rotation axis may differ from the wafer center by an unknown eccentricity. The flat angle is found by fitting a cosine curve to the data, subtracting the expected data derived from the cosine curve from the actual data to obtain a deviation. The angle of maximum deviation of the data from the cosine curve is a first estimate of the flat angle. The estimate may be corrected for errors due to a finite number of data points and wafer eccentricity by calculating an adjustment angle from data points on the wafer flat. After determining the flat angle, the wafer is spun to the desired orientation. The wafer eccentricity may be calculated from four of the data points located away from the flat edge region, and the wafer is then centered.

Claims

1. A method of locating the peripheral flat edge of a wafer comprising,

(a) placing a wafer onto a wafer chuck rotatable about an axis,

(b) spinning said wafer about said axis for one 360 degree rotation,

(c) determining the orientation of said chuck with respect to an initial orientation,

(d) sampling the position of said edge of said wafer for a plurality of chuck orientations to obtain a set of data points, each data point consisting of an orientation angle and a corresponding edge position,

(e) fitting a cosine curve to said set of data points,

(f) subtracting said cosine curve at each of said orientation angles from said corresponding edge positions to obtain a second set of points representing the deviation of said data points from said cosine curve, and

(g) finding the angle of maximum deviation of said data points from said cosine curve, said angle being an estimate of a flat edge angle indicating the location of said flat edge of said wafer with respect to said axis of rotation.

2. The method of claim 1 further comprising,

(h) rotating said wafer about said axis to a preselected orientation with respect to said flat edge angle.

3. The method of claim 1 further comprising after step (g),

finding a fine adjustment to said estimate of said flat edge angle, said fine adjustment being an angle β

determined according to the equation ##EQU13## where P_a and P_b are edge positions taken from said set of data points for orientation angles immediately preceding and succeeding said angle of maximum deviation, respectively, and where θ

is the angle between adjacent data points, and

subtracting said angle β

from said angle of maximum deviation to obtain a truer estimate of said flat edge angle.

4. The method of claim 1 further comprising after step (g),

selecting first, second, third and fourth data points from said set of data points located away from any flat edge of said wafer, said first and third data points being 180 degrees apart from one another, said second and fourth data points being 180 degrees apart from one another and 90 degrees apart from said first and third data points respectively, a first line being defined through said axis of rotation between said first and third data points, a second line being defined through said axis of rotation between said second and fourth data points,

calculating from the corresponding edge positions of said first and third data points a projection of the center of the wafer onto said first line,

calculating from the corresponding edge positions of said second and fourth data points a projection of the center of the wafer onto said first line,

moving said wafer on said chuck successively parallel to said first and second lines until the center of said wafer and said axis of rotation coincides.

5. The method of claim 4 wherein calculating the projection onto the first line comprises finding the mean of the edge positions of said first and third data points and subtracting said mean from the edge position of one of said first and third data points, and wherein calculating the projection onto the second line comprises finding the mean of the edge position of said second and fourth data points and subtracting said mean from the edge position of one of said second and fourth data points.

6. The method of claim 1 wherein said cosine curve at each of said orientation angles, θ

_i for i=O to N-1, N being the number of data points in the set, is represented by the corresponding set of points P_i satisfying the equation

space="preserve" listing-type="equation">P.sub.i =r+(e cos φ

) cos θ

.sub.i +(e sin φ

) sin θ

.sub.i

where ##EQU14## P_i is the corresponding edge position of the wafer at orientation angle θ

_i.

7. The method of claim 6 wherein said orientation angles, θ

_i satisfy the equation ##EQU15## for i=0 to N-1.

8. A method of locating the peripheral flat edge of a wafer comprising,

(a) placing a wafer onto a wafer chuck rotatable about a rotation axis,

(b) spinning said wafer about said axis for one 360 degree rotation,

(c) determining the orientation of said chuck with respect to an initial orientation,

(d) sampling the position of said edge of said wafer relative to said rotation axis for a plurality of chuck orientations to obtain a set of N data points, each data point i consisting of an orientation angle θ

_i and a corresponding edge position P_i,

(e) calculating from said set of data points a mean r, and cosine and sine components, e cos φ and

e sin φ

respectively, of a cosine curve representing expected values P_i of said data points,

(f) subtracting said expected P_i at each of said orientation angles θ

_i from said corresponding edge positions P_i to obtain a second set of points Δ

_i representing the deviation of said data points from said cosine curve, and

(g) finding an orientation θ

_j such that Δ

_j is the minimum in the second set of points, said angle θ

_j being an estimate of a flat edge angle indicating the location of the flat edge of said wafer with respect to said rotation axis.

9. The method of claim 8 wherein said N data points are sampled at incremental orientation angles ##EQU16## for i=0 to N-1.

10. The method of claim 9 further comprising,

calculating a fine adjustment angle β

to said estimate θ

_j according to the equation ##EQU17## where P_a and P_b are edge positions taken from said set of data points for orientation angles immediately preceding and succeeding orientation angle θ

_j, and

subtracting said angle β

from angle θ

_j to obtain a truer estimate of said flat edge angle.

11. The method of claim 8 further comprising,

(h) rotating said wafer about said axis to a preselected orientation with respect to said flat edge angle.

12. The method of claim 8 further comprising,

(h) selecting first, second, third and fourth data points from said set of data points, said first data point located in a range from 23 to 30 degrees away from said flat edge angle, said third data point located 180 degrees from said first data point, said second and fourth data points being 180 degrees apart from one another and 90 degrees away from said first and third data points respectively, a first line being defined through said rotation axis between said first and third data points, a second line being defined through said rotation axis between said second and fourth data points,

(i) determining a mean of the edge positions of said first and third data points and subtracting said mean from the edge position of one of said first and third data points to obtain a first value representing the projection of the center of the wafer onto said first line in the direction of said one of said first and third data points from said rotation axis,

(j) determining a mean of the edge points of said second and fourth data points and subtracting said mean from the edge position of one of said second and fourth data points to obtain a second value representing the projection of the center of the wafer onto said second line in the direction of said one of said second and fourth data points from said rotation axis, and

(k) moving said wafer on said chuck successively parallel to said first and second lines by the amounts of said first and second values respectively, so that said center of said wafer and said rotation axis coincide.

13. A wafer orientation determining apparatus comprising,

a wafer chuck for engaging a wafer, said chuck being rotatable about an axis,

means for rotating said chuck,

means for determining the orientation of said chuck with respect to an initial orientation and producing a first electrical signal representing an orientation angle of said chuck,

means for detecting the position of an edge of said wafer with respect to said axis and producing a second electrical signal representing said wafer edge position,

means in electrical communication to receive said first and second electrical signals for producing a plurality of data points therefrom for a plurality of chuck orientations, each data point consisting of an orientation angle and a corresponding edge position, said sampling means producing data signals representing said data points, and

computer means connected to said sampling means to operatively receive said data signals for:

(a) fitting a cosine curve to said data points,

(b) subtracting said cosine curve at each of said orientation angles from said corresponding edge position to obtain a deviation, and

(c) determining the orientation angle where said deviation is greatest, said angle representing the location of flat edge of said wafer with respect to said axis of rotation.

14. The wafer orientation apparatus of claim 13 wherein said means for detecting the wafer edge position comprises a linear photodetector array positioned under an edge of said wafer and aligned radially with respect to said axis of rotation, and a light source illuminating said wafer edge and a portion of said linear array not covered by said wafer edge.

15. The wafer orientation apparatus of claim 13 wherein said computer means further calculates a fine adjustment angle β

from edge positions P_a and P_b taken from data points on said flat edge preceding and succeeding said orientation angle where said deviation is greatest, said angle β

determined according to the equation;

##EQU18## where θ

is half the angle between said data points, and subtracts said angle β

from said orientation angle where said deviation is greatest.