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Extremely lightweight, flexible semiconductor device arrays

  • US 4,754,544 A
  • Filed: 09/29/1986
  • Issued: 07/05/1988
  • Est. Priority Date: 01/30/1985
  • Status: Expired due to Term
First Claim
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1. A process for producing an electronic device, said process including the steps of:

  • providing a substrate member;

    depositing a semiconductor body atop the substrate;

    subjecting the semiconductor body bearing side of the device to further processing steps;

    encapsulating the semiconductor body bearing side;

    subjecting the substrate side of the device to further processing steps; and

    encapsulating the substrate side of the device.

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