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Apparatus for inspecting the coplanarity of leaded surface mounted electronic components

  • US 4,754,555 A
  • Filed: 05/18/1987
  • Issued: 07/05/1988
  • Est. Priority Date: 05/18/1987
  • Status: Expired due to Fees
First Claim
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1. Apparatus for inspecting the coplanarity of the legs of leaded surface mounted IC components, comprising:

  • means forming a plurality of electrical contact elements disposed in a geometrical array with each contact element being disposed in a position so as to contact a corresponding leg of an IC package to be inspected, each said contact element being resiliently supported and depressable a predeterminned distance in a direction normal to a reference plane defined by the contact surfaces of said contact elements when in either their rest position or their fully depressed position;

    wiper means for engaging each leg of an IC package being inspected at a point intermediate the board contact point of the leg and its point of attachment to the IC package body;

    andmeans for applying an electrical voltage across each contact element and a corresponding wiper means, and including an indicator for indicating current flow between a particular contact element and its corresponding wiper means through a contacting leg of the IC package under inspection, whereby when the IC package is disposed with its legs aligned with each of said contact elements and a vertical force is applied thereto tending to urge each said contacting element against its resilient support, an indication will be provided identifying each leg which fails to make contact with one of said contacting elements.

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