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Infrared detector with improved heat dissipation

  • US 4,755,676 A
  • Filed: 12/19/1986
  • Issued: 07/05/1988
  • Est. Priority Date: 12/19/1986
  • Status: Expired due to Fees
First Claim
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1. A low temperature assembly comprising:

  • (a) a module base,(b) a first electrical circuit component mounted on the base in heat conductive relation thereto,(c) means for cooling said base to a first low temperature to thereby maintain said first circuit component at such first low temperature,(d) a second electrical circuit component having electrical connection to said first circuit component,(e) means for mounting said second circuit component upon said base in substantial thermal insulation therefrom, and(f) means for cooling said second circuit component to a second temperature above said first low temperature and below ambient temperature.

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