Infrared detector with improved heat dissipation

• US 4,755,676 A
• Filed: 12/19/1986
• Issued: 07/05/1988
• Est. Priority Date: 12/19/1986
• Status: Expired due to Fees

• Current Assignee: Hughes Aircraft Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Gaalema, Stephen D., Augustine, Frank L.
• Primary Examiner(s): FALCONE, JANICE ARRINGTON
• Application Number:
  US06/944,705
• Time in Patent Office: 564 Days
• Field of Search: 250/352, 250/370 L, 250/338 SE, 307/310
• US Class Current: 250/352
• CPC Class Codes: F25D 19/006 Thermal coupling structure or interface
• CPC Class Codes: G01J 5/061 by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052

Abstract

An infrared detector has its sensor chip assembly (10,12,14) cooled to a relatively low temperature required for its operation, whereas a preamplifier (56) required to be positioned close to the sensor chip assembly and which generates considerably more heat than does the sensor chip assembly, is thermally isolated from the sensor chip assembly and its support (16) and is cooled to a higher temperature to thereby significantly reduce the power dissipated to the coldest refrigerator stage (90).

Claims

1. A low temperature assembly comprising:

(a) a module base,

(b) a first electrical circuit component mounted on the base in heat conductive relation thereto,

(c) means for cooling said base to a first low temperature to thereby maintain said first circuit component at such first low temperature,

(d) a second electrical circuit component having electrical connection to said first circuit component,

(e) means for mounting said second circuit component upon said base in substantial thermal insulation therefrom, and

(f) means for cooling said second circuit component to a second temperature above said first low temperature and below ambient temperature.

2. The low temperature assembly of claim 1 wherein said means for cooling said base comprises a first refrigeration source thermally coupled to said base, and wherein said means for cooling said second circuit component comprises a second refrigeration source having a temperature above the temperature of said module base, and means for thermally coupling said second circuit component to said second refrigeration source.

3. The low temperature assembly of claim 2 wherein said first electrical circuit component comprises an infrared detector array and a multiplexer chip, and wherein said base has a front end and sides, said detector array and multiplexer being mounted on said front end, and said preamplifier being mounted on one of said sides.

4. The low temperature assembly of claim 3 wherein said electrical connection comprises a thermally and electrically nonconductive substrate having a plurality of electrically conductive lines formed therein, said electrically conductive lines having low thermal conductance.

5. The low temperature assembly of claim 4 wherein said substrate and conductive lines comprise a quartz plate having a plurality of electrically conductive traces formed on a surface thereof.

6. A method of cooling an infrared sensor assembly of the type wherein a sensor chip and and preamplifier chip are mounted on a module base and electrically interconnected with one another, said method comprising the steps of:

(a) mounting the sensor chip on the module base in thermally conductive relation thereto,

(b) mounting the preamplifier chip on the module base adjacent the sensor chip and in thermal isolation from the module base and sensor chip,

(c) cooling said module base to a first low temperature required for operation of said sensor chip, and

(d) cooling the preamplifier chip to a second low temperature above said first low temperature.

7. The method of claim 6 including the step of electrically connecting said sensor and preamplifier chips by electrically conductive traces of low thermal conductance.

8. The method of claim 7 wherein said step of mounting said preamplifier chip comprises fixing a body of low thermal conductance to said module base, and mounting said preamplifier chip on said body, said step of electrically connecting including forming said electrically conductive traces on said body.

9. Apparatus for cooling first and second electronic components of a system operating in an environment having an ambient temperature, wherein the first of said components is to be cooled to a first predetermined temperature that is extremely low relative to said ambient temperature, and wherein the second component generates significantly more heat than said first component, said apparatus comprising:

(a) cooling means having first and second refrigeration sources, said first source being maintained at said first predetermined temperature, and said second source being maintained at a second predetermined temperature above said first temperature and below said ambient temperature,

(b) a base of high thermal conductivity thermally coupled to said first source,

(c) means for mounting said first component on said base in good thermal contact therewith,

(d) thermal isolating means for mounting said second component on said base near said first component in thermal isolation from said base, and

(e) conduit means for thermally coupling said second component to said second refrigeration source.

10. The apparatus of claim 9 characterized further in that said base comprises a metal block and said thermal isolating means comprises a quartz plate mounted on said block.

11. The apparatus of claim 10 characterized further in that said quartz plate carries electrically conductive traces of low thermal conductivity for establishing part of an electrical path between said components while minimizing heat transfer from said second component to said first component.

12. The apparatus of claim 11 characterized further in that said conduit means comprises a thermally conductive metal strip mounted at one end of said quartz plate, said second component being mounted on and thermally coupled to said metal strip near said one end.

13. An electronic module for use with a cryogenic cooling system having first and second cooling stages wherein the second stage is cooled to a higher temperature than said first stage, said module comprising:

(a) a thermally conductive base,

(b) means for thermally coupling said base to said first cooling stage,

(c) a first electronic component mounted on and thermally coupled to said base,

(d) a thermally insulative member mounted on said base,

(e) a second electronic component mounted on said thermally insulative member and spaced from said first electronic component,

(f) means for electrically interconnecting said first and second components,

(g) means for electrically connecting said first electronic component to auxiliary circuitry remote from said module, and

(h) thermally conductive means thermally coupled to said second component for conducting heat therefrom to said second cooling stage.

14. The electronic module of claim 13 characterized further in that said base is a block having mounting surfaces extending from its side, and in that said thermally insulative member comprises a quartz plate secured to said mounting surfaces so as to span a side of said block in spaced relation thereto.

15. The electronic module of claim 14 characterized further in that said thermally conductive means comprises a thermally conductive strip anchored at one end on said quartz plate, and said second electronic component is mounted on said thermally conductive strip near said one end so as to be thermally coupled thereto.

16. The electronic module of claim 14 characterized further in that said block is made of tungsten having an I-shaped cross section, and having top and bottom cross members forming said mounting surfaces.

17. The electronic module of claim 13 characterized further in that said thermally insulative member is a quartz plate, and said electrically interconnecting means include traces composed of a mixture of titanium and nickel formed on said plate.

18. The electronic module of claim 13 characterized further in that said electrically interconnecting means includes electrically conductive links of low thermal conductivity to prevent heat leakage from said second electronic component to said first electronic component.

19. The electronic module of claim 13 characterized further in that said module includes a second thermally insulative member mounted on said base, and in that said electrically interconnecting means include electrically conductive paths of low thermal conductivity to minimize heat flow to said first electronic component, said electrically conductive paths being electrically connected to said first component.

20. The electronic module of claim 19 charcterized further in that said block is I-shaped in cross section having upper and lower lateral cross members forming extensions on which said first and second insulative members are mounted so as to extend along opposite sides of said block in spaced relation to the sides of the block for a major portion of the extent of the block.

21. For use with an electronic component assembly having a base cryogenically cooled to a component operating temperature, a first component mounted on the base in thermal contact therewith and cooled by the base to the component operating temperature, and a second electronic component having electrical connection with said first component, an improved method for cooling said second component comprising the steps of:

(a) mounting a thermal insulating body to said base adjacent said first component,

(b) mounting said second component to said body adjacent said first component, and

(c) cryogenically cooling said second component to a second temperature above said operating temperature.

22. The method of claim 21 including the step of forming said electrical connection of material having low thermal conductance to decrease transfer of heat between said components.