Emission microscopy system

• US 4,755,874 A
• Filed: 08/31/1987
• Issued: 07/05/1988
• Est. Priority Date: 08/31/1987
• Status: Expired due to Term

• Current Assignee: EDO Corporation (ITT, Inc.)
• Original Assignee: KLA Instruments, Corporation
• Inventors: Van Gelder, Ezra, Rosengaus, Eliezer, Esrig, Paul
• Primary Examiner(s): Britton, Howard W.
• Application Number:
  US07/091,682
• Time in Patent Office: 309 Days
• Field of Search: 358/93, 358/101, 358/106, 358/107, 358/211, 358/225
• US Class Current: 348/126
• CPC Class Codes: G01N 2021/95638 for PCB's
• CPC Class Codes: G01N 21/66 electrically excited, e.g. electroluminescence
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G01R 31/308 using non-ionising electromagnetic radiation, e.g. optical radiation investigating or analysing materials by the use of optical means G01N21/00; image analysis G06T7/00
• CPC Class Codes: G06T 2207/10056 Microscopic image
• CPC Class Codes: G06T 2207/20036 Morphological image processing
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

An optical emission microscopy system with a macro optic system having a high numerical aperture for obtaining global views of an integrated circuit Device Under Test (DUT). The DUT is subjected to illumination and stimulation conditions, and images are obtained to form a "global difference" image in which defects, wherever located in the chip, can be discerned by the system operator. The operator can select apparent "defect bright spots" to be further inspected, and zoom in with the higher magnification micro optics system to repeat the image formation steps. "Difference images" are processed to further eliminate noise spots using an improved two-stage filtering operation. The system may be operated under manual or automatic control, and may be interfaced to various data input, storage, and output devices as desired.

Claims

1. Emission microscopy means for detecting light emitted from defects in dielectric layers of integrated circuit devices in response to test vector signals applied to the input and output terminals of the integrated circuit device, comprising:

mounting means for holding the device under test to be inspected;

optical means including macro optic means having a high numerical aperture for obtaining global optical images of said device under test and including micro optic means for alternatively obtaining micro optical images of sub-areas of said device under test;

primary camera means for converting said optical images into analog electronic signals, said camera means including light intensifier means and being capable of integrating the analog electronic signals;

video image signal processing means for processing said analog electronic signals; and

video image display means for displaying signals processed by said video image processing means.

2. Apparatus as in claim 1 wherein said macro optic means has a numerical aperture of at least 0.025.

3. Apparatus as in claim 2 further including illumination means for illuminating said device under test at light intensity levels automatically controlled by said computer means.

4. Apparatus as in claim 2 wherein operations of said system are controlled by said image processing means under the control of mouse input means.

5. Apparatus as in claim 2 wherein said display means includes storage means.

6. Apparatus as in claim 5 wherein said storage means includes means of providing a previously verified good integrated circuit image by said display means and comparison with said displayed processed difference image.

7. Apparatus as in claim 5 wherein said storage means includes floppy disk storage means.

8. Apparatus as in claim 5 wherein said storage means includes video image printer means.

9. Apparatus as in claim 2 wherein said mounting means and said optical means are moveable with respect to each other automatically under programmed control by said signal processing means.

10. Apparatus as in claim 9 wherein said mounting means includes wafer chuck means, probe means, and wherein both said mounting means and said optical means are moveable with respect to each other automatically under programmed control by said signal processing means.

11. Apparatus as in claim 9 wherein said mounting means includes a socket adaptor module with local switches and auxillary signal input means for applying selected test vector voltages to said input and output terminals.

12. Apparatus as in claim 11 wherein said mounting means includes means to mount a second device under test adjacent the first mentioned device under test, and said module includes means for applying test vectors to said second device under test.

13. Apparatus as in claim 9 further including auxillary camera means for providing a display image to supplement the image provided by said primary camera means.

14. Apparatus as in claim 9 wherein said micro optic means includes a plurality of lenses means having magnification powers in the range between 10 and 100 times, and is engageable in the optical axis of said primary camera by the computer.

15. Apparatus as in claim 9 wherein said mounting means includes stimulator module means for programmably applying selected test vectors to I/O terminals of a device under test inserted into said socket adaptor module.

16. Apparatus as in claim 15 further including CAD interface means for said image signal processing means to access IC composite layout images from a computer aided design system.

17. Apparatus as in claim 15 including ATE interface means for connecting said stimulator module to receive test vectors provided from an automatic test equipment system.

18. Apparatus as in claim 17 wherein said stimulator module is programmable to apply selected test vectors in a selected order through said stimulator module to a device under test.

19. A method of detecting light emitted from defects in dielectrics located at unknown coordinates in an integrated circuit device comprising the steps of:

obtaining a reference image of said device;

forming a background image of collectable noise;

applying electrical voltages to selected terminals of the integrated circuit device so as to cause light to be emitted at the locations of defects contained therein;

forming an emitted light image of said integrated circuit including the light emitted from defects contained therein;

forming a difference light image of said integrated circuit by subtracting said background image from said emitted image;

processing said difference image to remove noise and to produce a processed macro difference image;

superimposing said processed macro difference image onto said reflected image to form a superimposed image;

identifying defect bright spots on said superimposed image;

compiling a list of coordinates of said bright spots;

replacing said macro lens with a micro lens;

moving the axis of said micro lens over a first set of coordinates from said list;

forming a difference image of the local area in a window around said set of coordinates;

processing said difference image to remove noise and to produce a processed micro difference image;

superimposing said processed difference image over said micro reflected image; and

comparing said superimposed image to a reference image of said integrated circuit to locate coordinates of said defect, more precisely relative to said integrated circuit.

20. A method as in claim 19 wherein said step of obtaining a reference image includes illuminating said integrated circuit;

and

forming a reflected light image of said illuminated integrated circuit.

21. A method as in claim 19 wherein said step of processing includes filtering said image by spatial characteristics discrimination such as "erosion".

22. A method as in claim 19 wherein said step of processing includes performing context discrimination on said difference image.

23. A method as in claim 19 wherein said step of processing includes the step of painting said difference image.

24. A method as in claim 23 including the step of annotating said difference image.

25. A method as in claim 19 wherein said step of processing is programmably automatically performed.

26. A method as in claim 25 wherein said processing can be done with selectable gray level sensitivity.

27. A method as in claim 26 wherein said processing is done with selectable confidence levels.