High frequency circuit having a microstrip resonance element

• US 4,758,922 A
• Filed: 11/16/1987
• Issued: 07/19/1988
• Est. Priority Date: 11/14/1986
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited 1006 OAZA Kadoma-Shi Osaka Japan
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Ishigaki, Isao, Yabuki, Hiroyuki, Makimoto, Mitsuo
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/121,259
• Time in Patent Office: 246 Days
• Field of Search: 361/328, 361/329, 361/330, 361/320, 361/321, 455/315, 455/316
• US Class Current: 361/330
• CPC Class Codes: H01P 3/08 Microstrips; Strip lines
• CPC Class Codes: H01P 3/081 Microstriplines
• CPC Class Codes: H01P 7/082 Microstripline resonators H01P7/088 takes precedence
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/0723 provided by an inner layer of PCB
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence

Abstract

A miniaturized circuit for high frequency operation is formed of four successively superimposed dielectric layers, with a microstrip resonance element being sandwiched between two inner dielectric layers which themselves are sandwiched between opposing ground plane layers, and the other dielectric layers being respectively formed upon these ground plane layers. Circuit connection patterns are formed on the outer faces of the latter dielectric layers, and circuit components mounted thereon to form two circuit sections. The microstrip resonance element can be utilized as an inductive reactance element of an oscillator circuit, or as a filter circuit resonator element, and is effectively shielded by the ground plane layers which also effectively mutually isolate the two circuit sections.

Claims

1. A high frequency circuit comprising:

at least first, second and third successively superimposed dielectric layers;

a microstrip resonance element formed of a layer of electrically conducting material, sandwiched between said first and second dielectric layers;

a first ground plane layer comprising a layer of electrically conducting material formed below said first dielectric layer and connected to a circuit ground potential;

a second ground plane layer comprising a layer of electrically conducting material formed sandwiched between said second and third dielectric layers and connected to said ground potential; and

a circuit section comprising a circuit connection pattern formed of a layer of electrically conducting material disposed upon an upper face of said third dielectric layer and a plurality of circuit components mounted upon said circuit connection pattern.

2. A high frequency circuit according to claim 1, in which at least one of said first and second dielectric layers is of greater thickness than said third dielectric layer.

3. A high frequency circuit according to claim 1, in which at least one of said first and second dielectric layers is formed of a material exhibiting a lower degree of electrical loss under high frequency operation than a material forming said third dielectric layer.

4. A high frequency circuit according to claim 1, 2 or 3, and further comprising a through-aperture in the form of a slit, formed extending through all of said layers along a direction substantially perpendicular to the plane of each of said layers.

5. A high frequency circuit according to claim 4, and further comprising a layer of electrically conducting material formed over a surface of said slit and connected to said circuit ground potential.

6. A high frequency circuit according to claim 1, and further comprising a fourth dielectric layer disposed below said first dielectric layer to sandwich said first ground plane layer between said first and fourth dielectric layers, and a second circuit section comprising a second circuit connection pattern formed of a layer of electrically conducting material disposed upon a lower face of said fourth dielectric layer and a plurality of circuit components mounted upon said second circuit connection pattern.

11. A high frequency circuit according to claim 1 in which said high frequency circuit is a high frequency oscillator circuit, and in which said first circuit section comprises an oscillator circuit section which is connected to said microstrip resonance element, and said second circuit section comprises a buffer circuit section which is coupled to receive an oscillator signal from said oscillator signal and produce an output signal, and in which said oscillator circuit section and said buffer circuit section are respectively positioned at mutually opposite laterally extending sides of said slit.

7. A high frequency circuit comprising:

first, second, third and fourth successively superimposed layers of dielectric material;

a microstrip resonance element formed of a layer of electrically conducting material, sandwiched between said second and third dielectric layers;

a first ground plane layer comprising a layer of electrically conducting material sandwiched between said first and second dielectric layers and connected to a circuit ground potential;

a second ground plane layer comprising a layer of electrically conducting material formed sandwiched between said third and fourth dielectric layers and connected to said circuit ground potential;

a first circuit section comprising a first circuit connection pattern formed of a layer of electrically conducting material disposed upon an upper face of said fourth dielectric layer and a plurality of circuit components mounted upon said first circuit connection pattern and;

a second circuit section comprising a second circuit connection pattern formed of a layer of electrically conducting material disposed upon a lower face of said first dielectric layer and a plurality of circuit components mounted upon said second circuit connection pattern.

8. A high frequency circuit according to claim 7, and further comprising a through-aperture in the form of a slit, formed extending through all of said layers.

9. A high frequency circuit according to claim 7, and further comprising a layer of electrically conducting material formed over a surface of said slit and connected to said circuit ground potential.

10. A high frequency circuit according to claim 8 or 9, in which respective portions of said first and second circuit sections which are required to be mutually electrically isolated are respectively positioned on mutually opposite sides of said slit.

12. A high frequency circuit according to claim 10, in which said high frequency circuit is a filter circuit, and in which an input terminal of said filter circuit is formed in said first section, positioned at one laterally extending side of said slit and an output terminal of said filter circuit is formed in said second circuit section, positioned at the opposite side of said slit from said input terminal.