Alpha-particle protection of semiconductor devices

• US 4,761,335 A
• Filed: 03/07/1985
• Issued: 08/02/1988
• Est. Priority Date: 03/07/1985
• Status: Expired due to Fees

• Current Assignee: National Starch And Chemical Corporation (Ingredion Incorporated)
• Original Assignee: National Starch And Chemical Corporation (Ingredion Incorporated)
• Inventors: Fisher, Paul D., Aurichio, Joseph A.
• Primary Examiner(s): SLUBY, PATRICIA
• Application Number:
  US06/708,999
• Time in Patent Office: 1,244 Days
• Field of Search: 428/473.5, 428/352, 428/353, 428/354, 428/910, 488/901
• US Class Current: 428/352
• CPC Class Codes: C09J 2479/086 in the substrate
• CPC Class Codes: C09J 7/25 based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• CPC Class Codes: H01L 23/556 against alpha rays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/2839 with release or antistick coating
• CPC Class Codes: Y10T 428/2843 including a primer layer
• CPC Class Codes: Y10T 428/2848 Three or more layers
• CPC Class Codes: Y10T 428/31515 As intermediate layer
• CPC Class Codes: Y10T 428/31721 Of polyimide

Abstract

The present invention is a tape product suitable for use in the protection of semiconductor devices from alpha-particles. The product comprises a heat resistant support film, a pressure sensitive adhesive layer on one side of the support film, a least one alpha-particle protector member formed of a plastic material capable of protecting the semiconductor device releasably supported on the pressure sensitive adhesive, and a layer of heat resistant adhesive bonded to the plastic material on its side lying opposite to the side bonded to the pressure sensitive adhesive. Preferably, a primer layer lies between the heat resistant support film on the pressure sensitive adhesive to insure that clean removal of the support film and pressure sensitive adhesive from the surface of the alpha-particle protector member. In order to aid in this removal the surface of the alpha-particle protector member facing the pressure sensitive layer is also coated with a release coating. The product is used by bonding the heat resistant adhesive side of the transfer tape product to one or more die patterns on a semiconductor wafer and by then stripping the support film and pressure sensitive adhesive from the top surface of the applique after the applique.

Claims

1. A transfer tape product to protect semiconductor devices from alpha-particles which comprises:

(a) a support film;

(b) a pressure sensitive adhesive layer on one side of the support film;

(c) at least one alpha-particle protector member formed of a plastic material capable of protecting a semiconductor device from alpha particles when adhesively bonded to it, said member being releasably bonded to the side of the pressure sensitive adhesive layer (b) opposite to that side of the adhesive (b) which is bonded to the support film (a) and said protector member being of a configuration capable of protecting the semiconductor device from the alpha-particles; and

(d) a layer of heat resistant adhesive bonded to the plastic material (c) on its side lying opposite to the side bonded to layer (b) to allow for bonding of the member (c) to the semiconductor device to be protected from the alpha-particles.

2. A tape product as claimed in claim 1 in which the support film is a polyimide film.

3. A tape product as claimed in claim 1 wherein a primer layer lies between the support film (a) and the pressure sensitive adhesive layer (b).

4. A tape product as claimed in claim 1 wherein a release layer lies between the pressure sensitive adhesive layer (b) and the alpha-particles protector member (c).

5. A tape product as claimed in claim 1 wherein a primer layer lies between support film (a) and adhesive layer (b) and a release layer lies between adhesive layer (b) and the alpha-particle protector member (c).

6. A tape product as claimed in claim 1 wherein the alpha-particle protector member is formed of polyimide resin.

7. A tape product as claimed in claim 1 wherein both the support film and the alpha-particle protector are polyimide.

8. A tape product as claimed in claim 7 wherein a primer layer lies between the support film (a) and the pressure sensitive adhesive (b).