Barrier layer ceramic dielectric capacitor containing barium plumbate
First Claim
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1. A barrier layer ceramic capacitor, comprising:
- a ceramic wafer having first and second major surfaces, said wafer having a grain structure;
a first conducting layer bonded to said first major surface;
a second conducting layer bonded to said second major surface;
a glass compound diffused into the grain structure of said ceramic wafer to force a boundary layer insulator in boundary areas of said grain structure; and
wherein said ceramic wafer comprises a solid solution of modified barium plumbate having the formula;
space="preserve" listing-type="equation">Ba(Bi.sub.x Pb.sub.1-x)O.sub.3 O≦
x≦
25 mole %.
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Abstract
A barrier layer ceramic capacitor and a method of making the same, using barium plumbate or modified barium plumbate as the base material. The fabricating process is a one step process requiring a maximum sintering temperature of 1000° C.
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Citations
15 Claims
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1. A barrier layer ceramic capacitor, comprising:
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a ceramic wafer having first and second major surfaces, said wafer having a grain structure; a first conducting layer bonded to said first major surface; a second conducting layer bonded to said second major surface; a glass compound diffused into the grain structure of said ceramic wafer to force a boundary layer insulator in boundary areas of said grain structure; and wherein said ceramic wafer comprises a solid solution of modified barium plumbate having the formula;
space="preserve" listing-type="equation">Ba(Bi.sub.x Pb.sub.1-x)O.sub.3 O≦
x≦
25 mole %. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of producing a barrier layer ceramic of modified barium plumbate comprising the steps of:
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preparing a wafer of a ceramic composition having the formula;
space="preserve" listing-type="equation">Ba(Bi.sub.x Pb.sub.1-x)O.sub.3 for O≦
x≦
25 mole %;sintering said wafer; coating a first and a second surface of said sintered wafer with a glass compound; diffusing said glass into the grains of a boundary layer of said first and second surfaces of said wafer; and applying an electrode to each of said first and second surfaces of said glass coated wafer. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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Specification