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Single step solder process

  • US 4,761,881 A
  • Filed: 09/15/1986
  • Issued: 08/09/1988
  • Est. Priority Date: 09/15/1986
  • Status: Expired due to Term
First Claim
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1. An improved method of surface mountable components to both sides and leaded components to one side of a printed circuit board having first and second sides comprising the sequential steps of:

  • screening solder paste on lands for surface mount components located on the first side of the board;

    depositing adhesive on surface mount components receiving sites located on the first side of the board;

    placing the surface mount components on the first side of the board;

    curing the deposited adhesive;

    inverting the board;

    screening solder paste on surface mount component lands and into the through hole locations on the second side of the board;

    placing components on the second side of the board;

    drying the screened solder paste;

    reflowing the solder; and

    cleaning the board.

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