Heat dissipating housing for an electronic component

• US 4,763,225 A
• Filed: 08/25/1986
• Issued: 08/09/1988
• Est. Priority Date: 08/30/1985
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Frenkel, Ferdinand, Rapp, Lothar, Prussas, Herbert
• Primary Examiner(s): Envall, Jr., Roy N.
• Application Number:
  US06/900,070
• Time in Patent Office: 715 Days
• Field of Search: 361/386, 361/387, 361/388, 361/389, 361/381, 361/395
• US Class Current: 361/709
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4251 Sealed packages G02B6/4248 takes precedence
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4272 with mounting substrates of high thermal conductivity
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A heat dissipating housing (1, 4, 5, 6) with a tub (1, 4) and an outer cover (5, 6) seated on the tub (1, 4)--preferably hermetically tight--for an electronic circuit component (11, 17) which in operation gives off heat to be dissipated such as a light emitting diode (17) and/or a semiconductor driver chip (11) is disclosed. The circuit component (11, 17) is fastened on the bottom (1) of the tub (1, 4). In operation, the heat to be dissipated is to be transferred at least in considerable part via a heat removal body (5, 6) of the housing (1, 4, 5, 6) to an outer surface of the housing, preferably via a heat conducting outer cover (5, 6) serving as the heat removal body (5, 6) to the outer surface air, sweeping the housing. The dissipated heat removal to the cooling medium is improved by especially simple means in that at least a part of the inner surface of the bottom (1) as well as of the sidewalls (4) of the--on the whole--relatively poorly heat conducting tub (1, 4) is lined with at least one lining sheet (2) of good heat conduction, the lining sheet (2) having a transitional section of good heat conduction toward the circuit component (11, 17) as well as toward the heat removal body (5, 6).

Claims

1. A heat dissipating housing surrounded by a cooling medium, said housing comprising:

a tub defining an opening and a bottom for containing at least one circuit component which in operation gives off heat to be dissipated, wherein the circuit component is mounted on the bottom of the tub, the bottom defining an inner surface and the sidewalls are made of relatively poor heat conducting material;

a heat-conducting outer cover defining an outer surface for transferring heat to the cooling medium, the outer cover being positioned on the opening of the tub; and

at least one heat-conducting lining sheet, the lining sheet having a relatively good heat conduction toward the circuit component as well as toward the heat-conducting outer cover, wherein a substantial portion of the heat to be dissipated is transferred by the lining sheet from the circuit component to the outer cover.

2. The heat dissipating housing according to claim 1, wherein said at least one circuit component is a light emitting diode.

3. This heat dissipating housing according to claim 1, wherein said at least one circuit component is a semiconductor driver chip.

4. The heat dissipating housing according to claim 1, wherein said cooling medium is air.

5. The heat dissipating housing according to claim 1 wherein the lining sheet is insertable as a separate solid housing component into the tub of the housing.

6. The heat dissipating housing according to claim 1, wherein the circuit component is mounted directly on the lining sheet, the lining sheet section lying between the circuit component and the bottom of the tub.

7. The heat dissipating housing according to claim 1, further comprising a solid heat conducting bridge for conducting heat between the circuit component and the lining sheet.

8. The heat dissipating housing according to claim 1, further comprising:

a heat conducting inner cover, wherein the lining sheet defines a heat conduction bearing surface for supporting the inner cover and conducting heat to the inner cover; and

a heat conducting spring element for conducting heat from the inner cover to the outer cover, the spring element being positioned between the inner cover and outer cover.

9. The heat dissipating housing according to claim 8, wherein the spring element is stamped from a sheet and has feather tongues (19) for conducting heat between the inner cover and the outer cover.

10. The heat dissipating housing according to claim 1, wherein said lining sheet has at least one partition of good heat conducting material forming at least two chambers in the interior of the housing electrically shielded at high frequencies from one another.

11. The heat dissipating housing according to claim 1, wherein a plurality of thermal lining sheets are provided connected with one another with poor heat conduction, each lining sheet being connected with its own members of said at least one circuit component with good heat conduction, the members of the circuit component being respectively connected with different lining sheets with good heat conduction but connected with one another with poor heat conduction, and each of the lining sheets being connected with respective outer surfaces of the housing with good heat conduction.