×

Thin film deposition apparatus including a vacuum transport mechanism

  • US 4,763,602 A
  • Filed: 02/25/1987
  • Issued: 08/16/1988
  • Est. Priority Date: 02/25/1987
  • Status: Expired due to Term
First Claim
Patent Images

1. An apparatus for depositing thin films on a substrate, comprising:

  • at least one deposition module capable of maintaining an ultra high vacuum for depositing materials from reactive gases contained therein on a substrate;

    a load lock module capable of maintaining an ultra high vacuum, said load lock connected to said at least one deposition module;

    a gate valve between the deposition module and the load lock to allow the substrate to move from the load lock into the deposition module while minimizing contamination of the reactive gases; and

    a transportation mechanism having a transport shaft and a substrate carrier for moving the substrate between the load lock and said at least one deposition module, said transportation mechanism extending outwardly from the deposition module on the side of the deposition module opposite the load lock whereby the transportation shaft located therein reaches through the deposition module into the load lock to pull the substrate back into the deposition module, said transportation mechanism being adapted to operate within ultra high vacuum conditions so that the substrate can be moved from the load lock into the deposition module without breaking vacuum in the deposition module and contaminating the reactive gases contained therein.

View all claims
  • 8 Assignments
Timeline View
Assignment View
    ×
    ×