Adherent sandblast photoresist laminate

• US 4,764,449 A
• Filed: 11/01/1985
• Issued: 08/16/1988
• Est. Priority Date: 11/01/1985
• Status: Expired due to Term

• Current Assignee: IKONICS Corporation (TeraWulf, Inc.)
• Original Assignee: The Chromaline Corporation (TeraWulf, Inc.)
• Inventors: VanIseghem, Lawrence C.
• Primary Examiner(s): Michl, Paul R.
• Assistant Examiner(s): Hamilton, Cynthia
• Application Number:
  US06/794,083
• Time in Patent Office: 1,019 Days
• Field of Search: 430/275, 430/258, 51/310, 51/312, 430/271, 430/162, 430/271 A
• US Class Current: 430/162
• CPC Class Codes: B24C 1/04 for treating only selected parts of a surface, e.g. for carving stone or glass
• CPC Class Codes: G03F 7/12 Production of screen printing forms or similar printing forms, e.g. stencils
• CPC Class Codes: H05K 3/0044 Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/0073 Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces

Abstract

A sandblast photoresist laminate article of manufacture comprising an adhesive layer, a membrane support layer, and a resist layer can be used in etching the surface of articles with a pattern which can be revealed by the resist layer. The resist laminate is usable in a variety of modes of etching such as exposing the resist with a pattern, developing the pattern, applying the developed resist to the object, and etching the pattern into the object. Further, the resist can be used by applying the unexposed sheet-like resist to an object, exposing the resist with a pattern, developing the pattern and etching the pattern into the object. Lastly, the resist laminate can be used by exposing the resist with a pattern, applying the exposed resist to an object, developing the pattern, and etching the pattern into the object. The resist compositions are typically water developable after exposure with actinic radiation.

Claims

1. A resist laminate for adherent application to the surface of an object, for exposure and development to reveal an image transferable to the surface by particulate etching, which consists essentially of:

(a) a photoresist composition layer that is developable with aqueous media, the photoresist composition consisting essentially of;

(i) about 0.1 to 75% by weight of a water soluble, photo sensitive vinyl polymer having pendent hydroxyl groups and being capable of photo-generated insolubility;

(ii) about 20 to 75 wt-% of a polymeric film-forming binder;

(iii) an effective amount of a plasticizer sufficient to provide resiliency, flake resistance, delamination resistance, and shock resistance;

(iv) about 0.01 to 5% by weight of a photo crosslinking initiator composition effective to crosslink polymers having pendent hydroxyl groups; and

(v) about 0 to 1% by weight of a surfactant;

(b) a nonelastomeric support membrane; and

(c) an adhesive layer;

wherein each layer is held in substantially coextensive contact.

2. The laminate of claim 1 wherein the resist composition consists essentially of:

(a) about 5 to 35 wt-% of a polyvinyl alcohol polymer having an extent of hydrolysis of 85 to 90%;

(b) about 25 to 75 wt-% of a polyvinyl acetate polymer;

(c) about 5 to 25 wt-% of a dialkyl phthalate plasticizer;

(d) about 0.01 to 2% by weight of a diazonium salt photo initiator; and

(e) about 1% by weight of a surfactant.

3. The laminate of claim 1 wherein the plasticizer comprises di-n-butyl phthalate.

4. The laminate of claim 1 wherein the water soluble, photo sensitive vinyl polymer is a polyvinyl alcohol polymer.

5. The laminate of claim 1 wherein the water soluble, photo sensitive vinyl polymer is a polyvinyl pyrrolidone polymer.

6. The resist laminate of claim 1 wherein the photoresist composition layer is held in contact between the adhesive layer and the nonelastomeric support membrane.

7. A resist laminate for adherent application to the surface of an object, for exposure and development to reveal an image transferable to the surface by particulate etching, which consists essentially of:

(a) a photoresist composition layer that is developable with aqueous media;

(b) a nonelastomeric support membrane; and

(c) an adhesive layer;

wherein each layer is held in substantially coextensive contact and the support membrane layer is held in contact between the resist layer and the adhesive layer.