Electret transducing

• US 4,764,690 A
• Filed: 06/18/1986
• Issued: 08/16/1988
• Est. Priority Date: 06/18/1986
• Status: Expired due to Term

• Current Assignee: RTI Technologies PTE Ltd. (Intricon Corporation)
• Original Assignee: Lectret S. A.
• Inventors: Hubschi, Kurt, Murphy, Preston V.
• Primary Examiner(s): Shoop, Jr., William M.
• Assistant Examiner(s): Logan, Sharon D.
• Application Number:
  US06/875,596
• Time in Patent Office: 790 Days
• Field of Search: 307/400, 381/191, 29/592 E, 29/594
• US Class Current: 307/400
• CPC Class Codes: H04R 19/01 characterised by the use of electrets
• CPC Class Codes: H04R 25/604 of acoustic or vibrational transducers
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/49226 Electret making

Abstract

A backplate assembly for an electret transducer including a backplate, an electret layer covering one surface of the backplate, and a peripheral spacer on the same side of the backplate as the electret layer and around the entire periphery of the electret layer, the spacer being secured to the backplate by a thin layer of material of the electret layer located and compressed between the spacer and the backplate, the thin layer being substantially thinner than the electret layer. Also disclosed is using a peripheral ring to support a diaphragm spaced from a housing wall via support members extending from the ring.

Claims

1. A backplate assembly for an electret transducer comprising

a backplate,

an electret layer covering one surface of said backplate, and

a peripheral spacer on the same side of the backplate as said electret layer and around the entire periphery of said electret layer, said spacer being secured to said backplate by a thin layer of material of said electret layer located and compressed between said spacer and said backplate, said thin layer being substantially thinner than said electret layer.

2. The assembly of claim 1 wherein said spacer can move no further than said backplate resulting in an effective spacer height equal to the height of said spacer minus the thickness of said electret layer.

3. The assembly of claim 1 wherein said electret layer is made of Teflon.

4. The assembly of claim 1 wherein said thin layer is 2 microns or less in thickness, and said spacer is greater than 25 microns thick.

5. The assembly of claim 4 wherein said thin layer is less than or equal to 1 micron thick, and said spacer is more than 40 microns thick.

6. A method of making a backplate assembly comprising

providing a sandwich of a backplate, an electret layer covering one surface of said backplate, and a peripheral spacer on the same side of the backplate as said electret and around the entire periphery of said electret layer, and

applying sufficient pressure and temperature to cause the majority of electret layer material between said spacer and said backplate to be displaced outward, resulting in a very thin layer between said spacer and said backplate.

7. The method of claim 6 wherein said pressure is sufficiently high such that further increases in pressure do not result in a substantially thinner layer between the spacer and backplate.

8. The method of claim 7 wherein said electret layer is made of Teflon.

9. The method of claim 7 wherein said thin layer is 2 microns or less in thickness, and said spacer is greater than 25 microns thick.

10. The method of claim 8 wherein said thin layer is less than or equal to 1 micron thick, and said spacer is more than 40 microns thick.

11. A transducer including a backplate assembly comprising

a backplate,

an electret layer covering one surface of said backplate,

a peripheral spacer on the same side of the backplate as said electret layer and around the entire periphery of said electret layer, said spacer being secured to said backplate by a thin layer of material of said electret layer compressed between said spacer and said backplate, said thin layer being substantially thinner than said electret layer, and

a diaphragm spaced from said backplate by said spacer.

12. An electret transducer comprising

a housing defining an entry port to a chamber therein,

a diaphragm in said chamber, and

a diaphragm support including a pheripheral ring, one side of said ring being secured to said diaphragm and another side of said ring being secured to support members, said support members spacing said ring from a wall of said housing and providing an unobstructed path between said port and said diaphragm.

13. The transducer of claim 12 wherein said support members are a pair of parallel bars extending between and spaced from said ring.

14. The transducer of claim 13 wherein said bars are spaced from each other by a distance greater than the width of said entry port.

15. The transducer of claim 14 wherein said housing has large sides parallel to said diaphragm and thin sides perpendicular to said large sides, and said entry port is located at a thin side of said housing.

16. The transducer of claim 14 wherein said entry port directly faces said diaphragm.