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Semiconductor device and process for producing the same

  • US 4,764,804 A
  • Filed: 02/17/1987
  • Issued: 08/16/1988
  • Est. Priority Date: 02/21/1986
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a semiconductor substrate having a semiconductor element formed in a semiconductor active region;

    a multilayer wiring structure comprised of an insulator film and an electrically conductive electric wiring which are stacked one upon the other on the surface of said semiconductor substrate;

    a bump electrode for transferring an electric signal which is electrically connected to said electric wiring in said multilayer wiring structure; and

    a bump electrode for heat dissipation formed on the surface of said multilayer wiring structure through a thin diamond film as a ground layer.

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