High density electronic package comprising stacked sub-modules
First Claim
Patent Images
1. A method of forming a high-density electronic package comprising:
- forming a chip-carrying substrate which (a) has a metallization pattern thereon to provide electrical conductors extending to at least one conductor-providing edge of the substrate, and (b) provides a heat-conducting path to said edge of the substrate;
securing at least one IC chip to the chip-carrying substrate, such IC chip having electrical terminals thereon;
connecting the electrical terminals of the IC chip to the conductors on the chip-carrying substrate;
forming a spacer having a frame surrounding an open center portion;
securing the spacer to the chip-carrying substrate with the IC chip inside the open center portion;
the chip-carrying substrate, IC chip and spacer being a sub-module assembly;
securing together several of such sub-module assemblies to provide an integrated stack, containing several IC chips;
forming a stack-carrying substrate which (a) has a metallization pattern thereon to provide electrical conductors, and (b) provides a heat-conducting path;
integrating the stack of sub-module assemblies with the stack-carrying substrate by securing the conductor-providing edges of the chip-carrying substrates to the stack-carrying substrate in such a way as to (a) connect the conductors on the chip-carrying substrates to the conductors on the stack-carrying substrate, and (b) provide direct heat conduction from the edges of the chip-carrying substrates to the stack-carrying substrate.
7 Assignments
0 Petitions
Accused Products
Abstract
A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity, inside which one or more IC chips are located. Each cavity-providing sub-module may be formed either by securing a rectangular frame to a chip-carrying substrate, or by etching a cavity in a single piece of material. In the latter case, the chips are mounted on the flat surface of one sub-module, and located inside the cavity of the next sub-module.
-
Citations
18 Claims
-
1. A method of forming a high-density electronic package comprising:
-
forming a chip-carrying substrate which (a) has a metallization pattern thereon to provide electrical conductors extending to at least one conductor-providing edge of the substrate, and (b) provides a heat-conducting path to said edge of the substrate; securing at least one IC chip to the chip-carrying substrate, such IC chip having electrical terminals thereon; connecting the electrical terminals of the IC chip to the conductors on the chip-carrying substrate; forming a spacer having a frame surrounding an open center portion; securing the spacer to the chip-carrying substrate with the IC chip inside the open center portion; the chip-carrying substrate, IC chip and spacer being a sub-module assembly; securing together several of such sub-module assemblies to provide an integrated stack, containing several IC chips; forming a stack-carrying substrate which (a) has a metallization pattern thereon to provide electrical conductors, and (b) provides a heat-conducting path; integrating the stack of sub-module assemblies with the stack-carrying substrate by securing the conductor-providing edges of the chip-carrying substrates to the stack-carrying substrate in such a way as to (a) connect the conductors on the chip-carrying substrates to the conductors on the stack-carrying substrate, and (b) provide direct heat conduction from the edges of the chip-carrying substrates to the stack-carrying substrate. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A high-density electronic package comprising:
-
a stack-carrying, heat-conducting substrate having conductors formed thereon; a stack of sub-module assemblies extending in planes perpendicular to the stack-carrying substrate, and having edges secured to the stack-carrying substrate; each sub-module assembly comprising; (a) a chip-carrying, heat-conducting substrate having electrical conductors thereon, and having an edge secured to the stack-carrying substrate in such a way that heat is conducted from the chip-carrying substrate into the stackcarrying substrate; (b) an IC chip mounted on the chip-carrying substrate and electrically connected to the conductors on that substrate; and which the IC chip is located, and which is secured to the chip-carrying substrate; each spacer determining the distance between adjacent chip-carrying substrates in the stack of sub-module assemblies; and each chip-carrying substrate having its electrical conductors extending to the edge which is secured to the stack-carrying substrate and electrically connected to corresponding conductors on the stack-carrying substrate. - View Dependent Claims (7, 8, 9, 10, 11)
-
-
12. A high density electronic package containing IC chips, comprising:
-
a stack-carrying, heat-conducting substrate having electrical conductors formed thereon; and a stack containing sub-modules extending in planes perpendicular to the stack-carrying substrate, and each having an edge secured to the stack-carrying substrate in such a way that heat is conducted from the sub-module into the stack-carrying substrate; each sub-module having a heat-conducting, chip-carrying surface and a chip-surrounding cavity; at least one IC chip mounted on the chip-carrying surface of each sub-module; each chip-carrying surface having electrical conductors thereon which extend to the sub-module edge secured to the stack-carrying substrate, and which are electrically connected to corresponding conductors on the stack-carrying substrate. - View Dependent Claims (13, 14)
-
-
15. A method of forming a high-density electronic package containing IC chips, comprising:
-
forming a plurality of sub-modules, each having a chip-surrounding cavity and a heat-conducting chip-carrying surface; providing electrical conductors on the chip-carrying surface of each sub-module; mounting at least one chip on each chip-carrying surface and connecting it to the electrical conductors on that surface; stacking and securing together a plurality of sub-modules; providing a heat-conducting stack-carrying substrate having electrical conductors formed thereon; and securing the stacked sub-modules to the stack-carrying substrate with each sub-module extending in a plane perpendicular to the stack-carrying substrate, with a direct heat-conducting path from each sub-module into the stack-carrying substrate electrically connected to the electrical conductors on the chip-carrying surface of the sub-modules; each chip being located in a cavity of a sub-module. - View Dependent Claims (16, 17, 18)
-
Specification