×

Immersion cooled circuit module with improved fins

  • US 4,765,397 A
  • Filed: 11/28/1986
  • Issued: 08/23/1988
  • Est. Priority Date: 11/28/1986
  • Status: Expired due to Fees
First Claim
Patent Images

1. A processing component comprising,an enclosure (12) adapted to hold a dielectric liquid coolant (20),a plurality of circuit modules (14) which each have a planar array of one or more heat producing circuit devices, a heat conducting hat spaced orthogonally from the array, and means in the module for transferring heat from the array to the hat, the array defining a plane designated X-Y and the direction from the array to the hat being designated Z,means for supporting said modules in said enclosure, and means defining a path (25, 26, 27) for circulating the coolant past the circuit modules in a predetermined direction designated X,wherein the improvement comprises,a plurality of fins (30, 52) which extend from the hat in the Z direction and define channels (54) between the fins extending generally in the X direction, whereby the coolant increases in temperature in the upstream to downstream direction along the channels, said fins being substantially equal in thickness and equal in spacing in the Y dimension,a shroud (53) which is arranged over the fins to confine the coolant to the channels,said fins being tapered in the Z dimension in the upstream to downstream direction to decrease the cross sectional area of said channels linearly in the upstream to downstream direction to thereby increase the coolant velocity in said channels and compensate for the increase in temperature of the coolant between the upstream edge and the downstream edge of the circuit module.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×