Full panel electronic packaging structure and method of making same

• US 4,766,670 A
• Filed: 02/02/1987
• Issued: 08/30/1988
• Est. Priority Date: 02/02/1987
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Seraphim, Donald P., Toole, Patrick A., McBride, Donald G., Gazdik, Charles E.
• Primary Examiner(s): NOT, DEFINED
• Application Number:
  US07/009,981
• Time in Patent Office: 575 Days
• Field of Search: 361/398, 361/414, 29/840, 29/830, 29/593, 437/205
• US Class Current: 29/830
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/351 Thermal stress
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on a carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chip mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.

Claims

1. A method for making an electronic packaging structure comprising the steps of:

fabricating a substrate with circuitry having a plurality of bonding sites arranged in a selected pattern;

forming a layer of flexible polyimide film on a support structure, said flexible film sized and configured to cover the bonding sites of the circuitized substrate when said flexible film is mounted on the circuitized substrate, and said flexible polyimide film having a thickness of less than approximately 25.0 microns (about 0.001 inch);

circuitizing the flexible film on the support structure with a circuit pattern having a plurality of device attachment sites matching the selected pattern of bonding sites on the circuitized substrate, said circuit pattern including pads at each device attachment site for facilitating connection of an electronic device to the circuitry on the flexible film and lands for facilitating connection of the circuitry on the flexible film to the circuitry at the bonding sites on the circuitized substrate;

attaching a selected electronic device to the pads at each device attachment site of the circuitry on the flexible film using a controlled collapse chip connection (C-4) technique;

testing each of the electronic devices attached to the circuitized, flexible film; and

mounting the circuitized, flexible film, with the electronic devices attached thereto, on the circuitized substrate, only if for each matching bonding site on the circuitized substrate there is a corresponding electronic device, found to be functional after testing, which, as a result of this mounting step, will be electrically interconnected through the circuitry on the flexible film to the circuitry at the matching bonding site on the circuitized substrate.

2. A method for making an electronic packaging structure as recited in claim 1 further comprising the step of:

replacing any electronic devices found to be defective after testing, with functional electronic devices, before the circuitized, flexible film with the electronic devices is mounted on the circuitized substrate.

3. A method for making an electronic packaging structure as recited in claim 1 further comprising the step of:

burning in each of the electronic devices attached to the circuitized, flexible film before this film is mounted on the circuitized substrate.

4. A method for making an electronic packaging structure as recited in claim 1 further comprising the step of:

removing the support frame from the circuitized, flexible film after this film, with the electronic devices attached thereto, has been mounted on the circuitized substrate.

5. A method for making an electronic packaging structure as recited in claim 1 wherein the step of circuitizing the flexible film comprises:

depositing metal on the flexible film;

applying photoresist to the deposited metal;

exposing and developing the photoresist to leave a desired pattern of photoresist on the metal; and

removing the metal not protected by the photoresist.

6. A method for making an electronic packaging structure as recited in claim 5 wherein the flexible film comprises a sheet of polyimide and the step of depositing metal comprises depositing successive layers of chromium, copper, and chromium on said sheet of polyimide.