Process of forming enhanced heat transfer surfaces

• US 4,767,497 A
• Filed: 04/01/1987
• Issued: 08/30/1988
• Est. Priority Date: 04/01/1987
• Status: Expired due to Fees

• Current Assignee: BOC Group, Inc. (Messer Adolf Family)
• Original Assignee: BOC Group, Inc. (Messer Adolf Family)
• Inventors: Bandyopadhyay, Nikhiles, Krueger, Paul C., Shattes, Walter J.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/032,671
• Time in Patent Office: 517 Days
• Field of Search: 156/656, 156/664, 156/665, 252/79.2, 252/79.3, 252/142, 134/3, 134/41, 148/415-418, 165/133
• US Class Current: 216/104
• CPC Class Codes: C22F 1/04 of aluminium or alloys based thereon
• CPC Class Codes: C23F 1/20 for etching aluminium or alloys thereof
• CPC Class Codes: F28F 13/187 especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites

Abstract

Aluminum alloys suitable for fabrication into plate and fin type heat exchangers are subjected to a chemical etching procedure in order to improve the heat transfer efficiency thereof. Applicants have found that a high temperature heat treatment of an aluminum alloy plate material to produce a precipitate, followed by exposure to an etching composition, results in a heat exchanger surface modified by the formation of pits. The heat exchangers so modified may be advantageously used in the reboiler/condensor section of air separation units.

Claims

1. A process for enhancing the heat transfer properties of the surface of an aluminum alloy containing a pre-existing precipitate comprising subjecting said aluminum alloy to an etching composition for said precipitate for an effective period of time such that pits having an average size of from about 0.5 to 5 microns are formed in the surface, wherein prior to etching, the alloy is heating to a temperature sufficient to dissolve precipitates which, when subjected to said etching composition would form pits smaller than about 0.5 micron and quenched so that said precipitates do not reform, thereby minimizing the formation of pits smaller than about 0.5 micron.

2. The process of claim 1, wherein said aluminum alloy is heated to a temperature of from about 900°

to 1200°

F.

3. The process of claim 1, wherein said aluminum alloy is heated to a temperature greater than 1000°

F.

4. The process of claim 1, wherein said etching composition comprises an aqueous acid solution.

5. The process of claim 4, wherein said etching composition comprises an aqueous solution of nitric acid, hydrochloric acid and hydrofluoric acid.

6. The process of claim 1, wherein the average size of the pits is about 1 to 3 microns.

7. The process of claim 1, wherein said aluminum alloy is aluminum alloy Al 3003.

8. The process of claim 1, wherein the density of said pits on the surface is from about 10⁴ to 10⁶ per square centimeter.