Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor

• US 4,769,345 A
• Filed: 03/12/1987
• Issued: 09/06/1988
• Est. Priority Date: 03/12/1987
• Status: Expired due to Fees

• Current Assignee: OLIN Corporation
• Original Assignee: OLIN Corporation
• Inventors: Cherukuri, Satyam C., Butt, Sheldon H.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Pawlikowski, Beverly Ann
• Application Number:
  US07/025,130
• Time in Patent Office: 544 Days
• Field of Search: 174/52 FP, 220/359, 357/72, 357/74, 437/217, 437/213, 437/220, 29/837, 29/838, 29/840
• US Class Current: 29/827
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/1616 Cavity shape
• CPC Class Codes: H01L 2924/1617 Cavity coating
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10S 228/903 Metal to nonmetal
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/53178 : Chip component

Abstract

The present invention is directed to a process of forming a package for enclosing an electrical device wherein the enclosure contains a very low amount of oxygen and water vapor. The package includes a base and lid components bonded together by a sealing glass. The lid component contains a gettering alloy from which the oxide layer is removed prior to the final sealing of the package. The gettering alloy forms a refractory oxide layer under an oxide layer formed with the primary constituent of the alloy.

Claims

1. The process of forming a package having a hermetically sealed enclosure containing an electrical device, comprising the steps of:

providing a base component having a first surface;

providing a lid component comprised of a gettering alloy having a first surface, said surface oxidized to facilitate bonding;

providing a sealing glass composite;

coating the peripheral portion of said first surfaces of said base and lid components with said sealing glass composite leaving an uncoated area in the middle of said first lid and base components;

sintering the coating of sealing glass composite on said base and lid components;

providing a leadframe;

disposing said leadframe on the glass coated surface of said base component;

heating the assembly of said leadframe and the base component whereby the glass coating melts into a continuous glaze which bonds the leadframe to the base component;

substantially removing the oxide layer from the uncoated area of the lid component subsequent to the sintering step;

electrically interconnecting said electrical component to said leadframe;

stacking said lid component on the assembly of said leadframe and said base component to form the enclosure containing said electrical device, said lid and base components being stacked whereby the glass coating of the lid component contacts the glass coating of the base component; and

heating the assembly of said lid component, said base component and said leadframe to melt the glass coatings on the base and lid components and hermetically seal said enclosure, said heating step for a period of time whereby contact of the gas constituents and the getting alloy within the enclosure results in the amount to be less than about 100 parts per million and about 1000 parts per million, respectively, of the gas constituents.

2. The process of claim 1 wherein said heating step for hermetically sealing said enclosure being for the period of time so that the amount of water vapor within said enclosure is less than about 150 parts per million of the gas constituents.

3. The process of claim 1 including the step of selecting said gettering alloy of a first alloy capable of forming a continuous refractory oxide layer on its surface, said alloy having the major constituent being selected from the group consisting of copper, nickel, iron and composites thereof whereby a first oxide film formed on the surface of the lid component during the sintering step is predominately oxides of said major constituent.

4. The process of claim 3 wherein said first alloy includes reactive ingredients selected from the group consisting of aluminum, silicon, chromium, beryllium, titanium, gallium, indium, tin, calcium, strontium, barium, boron and combinations thereof, said reactive elements being sufficiently soluble in said alloy whereby said reactive element rapidly diffuses from the alloy to the surface during said heating step to form a refractory oxide film under the first oxide film.

5. The process of claim 4 including the step of providing said lid component with a first cavity in the uncoated area, said first cavity having a surface of said gettering alloy.

6. The process of claim 5 including the step of roughening the surface of said gettering alloy to increase the surface area in contact with the gas constituents in the enclosure.

7. The process of claim 5 including the step of cutting grooves on the surface of said gettering alloy to increase the surface area in contact with the gas constituents in the enclosure.

8. The process of claim 5 including the step of sintering at a temperature of about 350°

to about 400°

C. for a period of about 10 to about 30 minutes.

9. The process of claim 8 including the step of heating to hermetically seal the enclosure at a temperature of about 400°

to about 475°

C. for a period of about 5 to about 15 minutes.

10. The process of claim 9 including the step of forming said lid and base components of said gettering alloy.

11. The process of claim 10 including the steps of:

forming said base component of a metallic material; and

forming said lid component of a bi-clad, said bi-clad comprising;

one of the clad layers having said first surface being formed of said gettering alloy; and

the second clad layer being formed of a metal or second alloy having desired physical characteristics.

12. The process of claim 10 including the step of forming said leadframe of a precipitation hardenable, glass sealable alloy.

13. The process of claim 1 including the step of selecting the sealing glass from the group consisting of borate, borosilicate, lead borate, lead borosilicate and phosphate glasses.

14. The process of claim 1 wherein the step of removing the oxide layer includes immersing the surface having the first oxide layer into a pickling solution.

15. The process of forming a package having a hermetically sealed enclosure containing an electrical device, comprising the steps of:

providing a base component having a first surface;

providing a lid component having a first surface comprised of a material selected from the group consisting of metals, alloys, cermets, ceramics, ceramic-glass and ceramic-glass-metal composites;

affixing a strip of a gettering alloy to the first surface of said lid component;

providing a sealing glass composite;

coating the peripheral portion of said first surfaces of said base and lid components with said sealing glass composite leaving an uncoated area in the middle of said first lid and base components;

sintering the coating of sealing glass composite on said base and lid components;

providing a leadframe;

disposing said leadframe on the glass coated surface of said base component;

heating the assembly of said leadframe and the base component whereby the glass coating melts into a continuous glaze which bonds the leadframe to the base component;

substantially removing the oxide layer from said strip of gettering alloy;

electrically interconnecting said electrical component to said leadframe;

stacking said lid component on the assembly of said leadframe and said base component to form the enclosure containing said electrical device, said lid and base components being stacked whereby the glass coating of the lid component contacts the glass coating of the base component; and

heating the assembly of said lid component, said base component and said leadframe to melt the glass coatings on the base and lid components and hermetically seal said enclosure, said heating step for hermetically sealing said enclosure being for a period of time whereby contact of the gas constituents and the gettering alloy within the enclosure results in the amount of oxygen and water vapor within said enclosure to be less than about 100 parts per million and about 1000 parts per million, respectively, of the gas constituents.

16. The process of claim 15 wherein said heating step for hermetically sealing said enclosure being for the period of time so that the amount of water vapor within said enclosure is less than about 150 parts per million of the gas constituents.

17. The process of claim 15 including the step of selecting said gettering alloy of a first alloy capable of forming a continuous refractory oxide layer on its surface, said alloy having the major constituent being selected from the group consisting of copper, nickel, iron and composites thereof whereby a first oxide film formed on the surface of the lid component during the sintering step is predominately oxides of said major constituent.

18. The process of claim 15 wherein said first alloy includes reactive ingredients selected from the group consisting of aluminum, silicon, chromium, beryllium, titanium, gallium, indium, tin, calcium, strontium, barium, boron and combinations thereof, said reactive elements being sufficiently soluble in said alloy whereby said reactive element rapidly diffuses from the alloy to the surface during said heating step to form a refractory oxide film under the first oxide film.

19. The process of claim 18 including the step of roughening the surface of said gettering alloy to increase the surface area in contact with the gas constituents in the enclosure.

20. The process of claim 18 including the step of sintering at a temperature of about 350°

to about 400°

C. for a period of about 10 to about 30 minutes.

21. The process of claim 20 including the step of heating to hermetically seal the enclosure at a temperature of about 400°

to about 475°

C. for a period of about 5 to about 15 minutes.

22. The process of claim 21 including the step of forming said base component of said gettering alloy.

23. The process of claim 22 including the step of forming said leadframe of a precipitation hardenable, glass sealable alloy.

24. The process of claim 15 including the step of selecting the sealing glass from the group consisting of borate, borosilicate, lead borate, lead borosilicate and phosphate glasses.

25. The process of claim 24 wherein the step of removing the oxide layer includes immersing the surface having the first oxide layer into a pickling solution.