Semiconductor vapor phase growing apparatus

• US 4,770,121 A
• Filed: 02/03/1987
• Issued: 09/13/1988
• Est. Priority Date: 11/27/1982
• Status: Expired due to Fees

• Current Assignee: Toshiba Kikai Kabushiki Kaisha
• Original Assignee: Toshiba Kikai Kabushiki Kaisha
• Inventors: Komiyama, Yoshizo, Ebata, Hitoshi
• Primary Examiner(s): BUEKER, RICHARD R
• Application Number:
  US07/011,423
• Time in Patent Office: 588 Days
• Field of Search: 118/730, 118/729, 118/686, 118/687, 118/696, 118/697, 118/698, 118/704, 118/715, 118/729, 118/730, 118/500, 118/503, 414/273, 414/149, 414/161, 414/217, 414/730, 414/750, 414/225, 414/222, 414/136, 414/287, 901/36, 901/50
• US Class Current: 118/686
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling

Abstract

An apparatus for positioning a plurality of semiconductor substrates on a movable, support in a desired pattern, in a semiconductor vapor phase growing apparatus. A memory is provided for storing two dimensional data corresponding to the desired pattern. The desired pattern is predetermined by the sizes of the substrates and the space available on the flat support. A loading/unloading device loads and unloads the substrates on the support at positions corresponding to the two-dimensional data read from the memory. A positioning device positions the support so that the substrates can be loaded and unloaded at the predetermined positions. A control device synchronizes the movement of the loading/unloading device and the positioning device in accordance with the selected position so that the substrates are loaded and unloaded on the flat support in the desired pattern.

Claims

1. Apparatus for positioning a plurality of substrates on a movable support in a desired pattern, in a semiconductor vapor phase growing apparatus, comprising:

(a) a computer control system including;

(1) a central processing unit;

(2) first memory means with data areas having a plurality of positions corresponding to specific positions on a surface of said support, said data areas of said first memory means being defined by addresses storing corresponding data regarding said specific positions;

(3) means for correcting said specific position data stored in said first memory means in accordance with sizes of the substrates to generate corrected loading and unloading position data;

(4) temporary memory means storing said corrected loading and corrected unloading position data from said correcting means;

(5) a motor drive module connected to said central processing unit for moving said support; and

(6) second memory means storing (a) a position program for causing said central processing unit to supply said corrected loading and unloading position data in said temporary memory means to said motor drive module, and (b) a modified program for causing said means for correcting to correct said specific position data in accordance with sizes of said substrates to generate said corrected loading and unloading position data;

(b) loading/unloading means for loading and unloading said substrates onto and from said support at positions corresponding to said corrected loading and unloading position data, said loading/unloading means being movable in a vertical direction and extendable in a horizontal direction; and

(c) positioning means controlled by said motor drive module for moving said support so that said substrates can be loaded and unloaded thereon at positions corresponding to said corrected loading and unloading position data;

said computer control system synchronizing the movements of said loading/unloading means and said positioning means in accordance with said corrected loading and unloading position data so that said substrates are loaded and unloaded on said support in said desired pattern by movement of said support and vertical and horizontal movements of said loading/unloading means.

2. Apparatus according to claim 1 wherein said loading/unloading means includes detecting means for detecting a substrate.

3. Apparatus according to claim 1 wherein said temporary memory means stores test piece position data.

4. Apparatus according to claim 3 wherein said loading/unloading means loads and unloads test pieces onto and from said support at positions corresponding to said test piece position data.

5. Apparatus according to claim 4 wherein said loading/unloading means includes means for loading/unloading at least one test piece adjacent at least one substrate.

6. Apparatus according to claim 1 wherein said temporary memory means stores said corrected loading and unloading position data in the form of polar coordinates, and wherein said positioning means moves said support in accordance with one of said polar coordinates, and wherein said loading/unloading means positions said semiconductor substrates in accordance with a second one of said polar coordinates.

7. Apparatus according to claim 1 wherein said positioning means includes means for stopping said support at predetermined angular positions based on said corrected loading and unloading position data.

8. Apparatus according to claim 7 wherein said temporary memory means includes means for storing a plurality of angular positions and radial direction position information as said corrected loading and unloading position data, and wherein said loading/unloading means includes means for positioning said loading/unloading means in accordance with said radial direction position information from said temporary memory means.

9. Apparatus according to claim 1 wherein said temporary memory means includes means for storing loading position data and unloading position data for a plurality of substrates having different sizes.

10. Apparatus according to claim 1 further including said support, said support having a rotary support member with a polygonal cross-section, said rotary member being movable along its longitudinal axis.

11. Apparatus according to claim 10 wherein said temporary memory means includes means for storing a plurality of angular positions and a plurality of axial positions with respect to said polygonal rotary support member, and wherein said loading/unloading means is positioned according to the stored axial positions.

12. Apparatus according to claim 1 wherein said temporary memory means stores said loading position data and said unloading position data in the form of rectangular coordinantes, and wherein said positioning means moves said support in accordance with a first one of said rectangular coordinantes, and wherein said loading/unloading means loads and unloads said semiconductor substrates in accordance with a second one of said rectangular coordinantes.

13. The apparatus according to claim 1 wherein said support comprises a rotary member having a polygonal cross-section.

14. The apparatus according to claim 13 wherein said polygonal rotary support is shiftable along an axis thereof.

15. The apparatus according to claim 1 wherein said desired pattern is defined in terms of polar coordinates, said support is positioned along one direction of said polar coordinates by said positioning means, and said loading/unloading means is adapted to position said semiconductor substrates along the other direction of said polar coordinates.

16. Apparatus according to claim 1 including said substrates of substantially different sizes.

17. Apparatus according to claim 16 wherein said stored pattern is predetermined for a given set of numbers and sizes of said substrates.

18. Apparatus according to claim 1 wherein said desired pattern is defined in terms of X, Y coordinates.

19. The apparatus according to claim 1 wherein said support comprises a rotary disc.

20. Apparatus according to claim 19 wherein said desired pattern comprises a plurality of circles of substrates, said circles having different radii and being arranged coaxially with said rotary disc, said circles each containing different numbers of substrates.

21. Apparatus according to claim 20 wherein said computer control system synchronizes said rotary disc and said loading/unloading means so that all of said substrates are placed on said rotary disc in one revolution of said rotary disc.

22. Apparatus according to claim 20 wherein said substrates are substantially different sizes.

23. Apparatus according to claim 20 wherein said substrates of each of said circles are not radially colinear with the substrates of the other said circles.

24. The apparatus according to claim 20 wherein said temporary memory means has a plurality of memory regions respectively storing rotational angles of said support at which said substrates are to be mounted, absolute values of said rotational angles and radii of said circles.

25. The apparatus according to claim 20 wherein a semiconductor test piece having the same or different configuration as said substrates is interposed between adjacent substrates.

26. The apparatus according to claim 19 wherein said positioning means includes means for stopping said rotary disc at predetermined angular positions based on said desired pattern.

27. The apparatus according to claim 26 wherein said temporary memory means includes a plurality of memory regions for storing data regarding said angular positions of said support.

28. The apparatus according to claim 27 wherein said memory regions store other data regarding radial positions of said semiconductor substrates on said rotary disc and said loading and unloading means is positioned according to said other data.

29. The apparatus according to claim 28 wherein said temporary memory means stores said other data for a plurality of positions corresponding to substrates having different sizes.