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Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products

  • US 4,770,754 A
  • Filed: 04/01/1987
  • Issued: 09/13/1988
  • Est. Priority Date: 04/02/1986
  • Status: Expired due to Term
First Claim
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1. Apparatus for electroplating a metallic deposit on interconnected or bandoliered elongate metallic and/or metallized products, said apparatus comprising:

  • (a) first means for guiding and displacing the elongate products along a first predetermined path;

    (b) a plurality of masking devices each one of which comprises a solid, non-flexible pin surrounded by a material in the shape of a tube, said plurality of masking devices being attached in a regular pattern to an endless member;

    (c) second means for guiding and displacing said endless member along a second predetermined path a part of which coincides that a part of said first predetermined path so that each one of the elongate products is received between and contacts two adjacent ones of said plurality of masking devices; and

    (d) third means for supplying electrolyte to the elongate products while the elongate products are moving along said part of said first predetermined path.

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