Apparatus for supplying uniform tail lengths

• US 4,771,930 A
• Filed: 06/30/1986
• Issued: 09/20/1988
• Est. Priority Date: 06/30/1986
• Status: Expired due to Fees

• Current Assignee: Kulicke & Soffa Investments, Inc.
• Original Assignee: Kulicke and Soffa Industries Incorporated
• Inventors: Gillotti, Gary S., Leonhardt, David A.
• Primary Examiner(s): Godici, Nicholas P.
• Assistant Examiner(s): Skillman, Karen
• Application Number:
  US06/879,939
• Time in Patent Office: 813 Days
• Field of Search: 228/102, 228/1.1, 228/4.5, 228/10, 228/179, 228/104
• US Class Current: 228/102
• CPC Class Codes: B23K 20/005 Capillary welding
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/78302 Shape
• CPC Class Codes: H01L 2224/78313 Wedge
• CPC Class Codes: H01L 2224/78318 inside the capillary
• CPC Class Codes: H01L 2224/786 Means for supplying the connector to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/851 the connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01065 Terbium [Tb]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]

Abstract

A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing the bonding wire on the pad or electrode. If the fine wire is missing under the working face of the bonding tool, the sensing circuit initiates a signal which is detected by control means so as to initiate an interrupt signal stopping the operation of the wire bonder. Sensing of the presence or absence of a wire under the bonding wedge at a bond may take place at a first or a second wire bond. At the second wire bond, the novel sensing and detecting circuit is actuated to determine the amount of longation that takes place in the bonding wire between the bonding wedge and the wire clamps so as to correct the movement of the wire clamps when supplying a tail under the working face of the bonding tool and to ensure that a uniform tail length is supplied unaffected by the elongation of the bonding wire.

Claims

1. Apparatus for providing a uniform length tail to a wedge bonding tool of an automtic wedge bonder of the type having moving wire clamps, comprising:

wire clamps mounted on said wedge bonder,

means for sensing the presence of a bonding wire under the bonding wedge of said wedge bonder at the last bond before breaking the bonding wire with said wire clamps,

means for moving said wire clamps in a direction to elongate and break said bonding wire at said bonding wedge,

timing means for measuring the differential elongation imparted to said bonding wire before said bonding wire breaks,

control means coupled to said timing means for determining a uniform tail length which includes said elongation imparted to said bonding wire, and

said control means being coupled to said means for moving said wire clamps and for providing a control signal for differentially moving said wire clamps in a direction to provide a uniform length tail under said bonding wedge.

2. Apparatus as set forth in claim 1 wherein said means for sensing the presence of a bonding wire under the bonding wedge comprises a circuit having a low voltage power source coupled to a bonding transducer which supports said bonding wedge.

3. Apparatus as set forth in claim 2 which further includes means for electrically isolating said bonding transducer from the wire bonder.

4. Apparatus as set forth in claim 2 which further includes amplifier means coupled to said bonding transducer for providing an output voltage indicative of the presence or absence of said bonding wire under said bonding wedge.

5. Apparatus as set forth in claim 4 which further includes a reference voltage connected to said wire clamps whereby said output voltage further indicates the condition of said bonding wire between said wire clamps and said bonding wedge.

6. Apparatus as set forth in claim 4 wherein said control means includes a processor adapted to monitor said output voltage during elongation and breakage of said bonding wire and for calculating a pulse train indicative of the distance required to move said wire clamps to provide a uniform length tail.

7. Apparatus as set forth in claim 6 wherein said means for moving said wire clamps comprise a stepper motor.

8. Apparatus as set forth in claim 1 which further includes a wire spool drive motor coupled to a wire spool for supplying said bonding wire to said wedge bonding tool, and

wherein said control means are coupled to said wire spool drive motor for monitoring movement of said drive motor.

9. Apparatus as set forth in claim 8 wherein said control means is further coupled to said wire bonder for indicating an error condition when said wire spool drive motor does not feed bonding wire over a plurality of bonds.

10. The method of making uniform tail lengths under a bonding tool after a last bond comprising the steps of:

bonding a fine bonding wire to a semiconductor device target with a bonding tool,

clamping said bonding wire with wire clamps,

moving said wire clamps in a direction to break said fine bonding wire at said bonding tool,

measuring the differentially displacement of said wire clamps during the differentially elongation of said fine bonding wire between said bonding tool and said wire clamps until said bonding wire breaks at said bonding tool, and

differentially moving said wire clamp in a direction to supply a predetermined tail length of wire under the working face of said bonding tool without the elongation of said fine bonding wire to provide a uniform tail length under said bonding tool.

11. The method as set forth in claim 10 which further includes the steps of:

moving said wire clamps with a stepper motor, and

monitoring the time required to elongate said fine bonding wire to cause it to break.

12. The method as set forth in claim 11 which further includes the steps of:

calculating the elongation of said fine bonding wire, and

calculating the number of electrical steps required to provide a uniform tail length unaffected by said elongation.

13. The method as set forth in claim 12 which further includes the step of:

monitoring the movement of the wire spool feed motor to determine if bonding wire is being consumed during bonding operations.

14. Apparatus for supplying a uniform length tail bonding wire to a bonding tool of an automatic wedge bonder of the type having articulating wire clamps comprising:

a transducer mounted on said wedge bonder,

a bonding wedge mounted in said transducer opposite a semiconductor device to be bonded,

wire clamp means mounted on said wedge bonder for clamping a bonding wire fed to said bonding wedge,

means for moving said wire clamp means for elongation and breaking said bonding wire at a last bond and for feeding a predetermined length tail minus the amount of elongation under the working face of said wedge bonding tool,

timing means coupled to said means for moving said wire clamp for measuring the differential elongation imparted to said bonding wire before said bonding wire breaks,

circuit sensing means coupled to said transducer and to said wire clamp means for sensing the absence or presence of said bonding wire under said bonding wedge,

wire feed drive motor means for supplying a slack loop of bonding wire to said bonding wedge, and

control means coupled to said circuit sensing means, said timing means and said wire feed drive motor means for detecting the absence of a bonding wire at said bonding wedge and the amount of elongation of said fine wire and movement of said wire feed drive motor means.

15. Apparatus as set forth in claim 14 wherein said control means is coupled to said wire bonder and adapted to cease automatic wire bonding operations when no wire is sensed under said bonding wedge during a bonding operation.

16. Apparatus as set forth in claim 14 wherein said control means is coupled to said wire bonder and adapted to cease automatic wire bonding operations when no wire is being fed to said bonding wedge over a plurality of wire bonding operations.