Apparatus for supplying uniform tail lengths
First Claim
1. Apparatus for providing a uniform length tail to a wedge bonding tool of an automtic wedge bonder of the type having moving wire clamps, comprising:
- wire clamps mounted on said wedge bonder,means for sensing the presence of a bonding wire under the bonding wedge of said wedge bonder at the last bond before breaking the bonding wire with said wire clamps,means for moving said wire clamps in a direction to elongate and break said bonding wire at said bonding wedge,timing means for measuring the differential elongation imparted to said bonding wire before said bonding wire breaks,control means coupled to said timing means for determining a uniform tail length which includes said elongation imparted to said bonding wire, andsaid control means being coupled to said means for moving said wire clamps and for providing a control signal for differentially moving said wire clamps in a direction to provide a uniform length tail under said bonding wedge.
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Accused Products
Abstract
A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing the bonding wire on the pad or electrode. If the fine wire is missing under the working face of the bonding tool, the sensing circuit initiates a signal which is detected by control means so as to initiate an interrupt signal stopping the operation of the wire bonder. Sensing of the presence or absence of a wire under the bonding wedge at a bond may take place at a first or a second wire bond. At the second wire bond, the novel sensing and detecting circuit is actuated to determine the amount of longation that takes place in the bonding wire between the bonding wedge and the wire clamps so as to correct the movement of the wire clamps when supplying a tail under the working face of the bonding tool and to ensure that a uniform tail length is supplied unaffected by the elongation of the bonding wire.
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Citations
16 Claims
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1. Apparatus for providing a uniform length tail to a wedge bonding tool of an automtic wedge bonder of the type having moving wire clamps, comprising:
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wire clamps mounted on said wedge bonder, means for sensing the presence of a bonding wire under the bonding wedge of said wedge bonder at the last bond before breaking the bonding wire with said wire clamps, means for moving said wire clamps in a direction to elongate and break said bonding wire at said bonding wedge, timing means for measuring the differential elongation imparted to said bonding wire before said bonding wire breaks, control means coupled to said timing means for determining a uniform tail length which includes said elongation imparted to said bonding wire, and said control means being coupled to said means for moving said wire clamps and for providing a control signal for differentially moving said wire clamps in a direction to provide a uniform length tail under said bonding wedge. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. The method of making uniform tail lengths under a bonding tool after a last bond comprising the steps of:
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bonding a fine bonding wire to a semiconductor device target with a bonding tool, clamping said bonding wire with wire clamps, moving said wire clamps in a direction to break said fine bonding wire at said bonding tool, measuring the differentially displacement of said wire clamps during the differentially elongation of said fine bonding wire between said bonding tool and said wire clamps until said bonding wire breaks at said bonding tool, and differentially moving said wire clamp in a direction to supply a predetermined tail length of wire under the working face of said bonding tool without the elongation of said fine bonding wire to provide a uniform tail length under said bonding tool. - View Dependent Claims (11, 12, 13)
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14. Apparatus for supplying a uniform length tail bonding wire to a bonding tool of an automatic wedge bonder of the type having articulating wire clamps comprising:
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a transducer mounted on said wedge bonder, a bonding wedge mounted in said transducer opposite a semiconductor device to be bonded, wire clamp means mounted on said wedge bonder for clamping a bonding wire fed to said bonding wedge, means for moving said wire clamp means for elongation and breaking said bonding wire at a last bond and for feeding a predetermined length tail minus the amount of elongation under the working face of said wedge bonding tool, timing means coupled to said means for moving said wire clamp for measuring the differential elongation imparted to said bonding wire before said bonding wire breaks, circuit sensing means coupled to said transducer and to said wire clamp means for sensing the absence or presence of said bonding wire under said bonding wedge, wire feed drive motor means for supplying a slack loop of bonding wire to said bonding wedge, and control means coupled to said circuit sensing means, said timing means and said wire feed drive motor means for detecting the absence of a bonding wire at said bonding wedge and the amount of elongation of said fine wire and movement of said wire feed drive motor means. - View Dependent Claims (15, 16)
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Specification