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Apparatus for mounting a semiconductor chip and making electrical connections thereto

  • US 4,774,630 A
  • Filed: 09/30/1985
  • Issued: 09/27/1988
  • Est. Priority Date: 09/30/1985
  • Status: Expired due to Fees
First Claim
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1. Apparatus for mounting a semiconductor device chip and making electrical connections thereto, said apparatus comprising:

  • a substrate having a surface including electrical terminals thereon;

    a semiconductor device chip having a first surface in contact with the surface of the substrate and a second surface having a plurality of electrical pads disposed across the surface thereof, including interior surface portions inboard of the perimeter surface portions of the semiconductor device chip; and

    means electrically connecting the substrate electrical terminals and the semiconductor device chip electricl pads, the means including a surface having a plurality of first electrical contacts disposed generally across the interior portion thereof making aerial electrical and physical contact with the semiconductor device chip electrical pads, including those interior pads disposed inboard of the perimeter surface portions of the semiconductor device chip, and a plurality of second electrical contacts disposed generally around the perimeter of the surface of the means electrically connecting and being in physical and electrical contact with he substrate electrical terminals, the first and second electrical contacts of the means being electrically connected in a predetermined circuit.

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