Multilayer PC board using polymer thick films

• US 4,775,573 A
• Filed: 04/03/1987
• Issued: 10/04/1988
• Est. Priority Date: 04/03/1987
• Status: Expired due to Term

• Current Assignee: Poly Circuits, Inc.
• Original Assignee: West-Tronics, Inc.
• Inventors: Turek, Joseph A.
• Primary Examiner(s): Kittle, John E.
• Assistant Examiner(s): RYAN, PATRICK J
• Application Number:
  US07/034,791
• Time in Patent Office: 550 Days
• Field of Search: 428/209, 428/901, 174/68.5
• US Class Current: 428/209
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/092 Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes forming plated-through holes H05K3/42; cutting around hole H05K2203/0242
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 2203/0571 Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
• CPC Class Codes: H05K 3/243 characterised by selective plating, e.g. for finish plating of pads selective plating for making the circuit pattern H05K3/108, H05K3/182
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/3468 Applying molten solder
• CPC Class Codes: H05K 3/3473 Plating of solder
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A multilayer printed circuit board which reliably and economically marries conventional copper clad printed circuit board technology with polymeric conductors and insulators. Reliability is enhanced by forming all solder pads of copper, providing conductive tails on solder pads which are to be connected by polymeric inks, and ultimately forming a solder resist over all but the solder pads. As a result, polymer inks can be applied to both sides of the board, and the completed board can be subject to conventional solder dipping or wave soldering operations. According to one feature of the invention, a thin dielectric layer can be applied as intermediate to planar conductive layers which form a power plane having built-in distributed capacitance for decoupling.

Claims

1. A multilayer circuit board for mounting and establishing electrical connections between a plurality of electrical components intended for later mounting on the circuit board, said multilayer circuit board comprising in combination:

a supporting substrate having a copper layer on at least one side etched to form (a) an array of solder pads for receiving the components to be mounted on said circuit board, and (b) conductive tails connected to said solder pads for providing protected electrical connections to said solder pads,

a dielectric layer over said copper layer leaving said tails and said pads exposed,

conductive polymer traces over said dielectric layer interconnecting selected ones of said tails thereby to form connections between selected ones of said pads,

a solder mask over said conductive polymer leaving said pads exposed but covering said tails thereby to shield the polymer, and

a solder layer plated onto the exposed solder pads for providing a surface for solder connections to the electrical components.

2. The multilayer circuit board of claim 1, wherein said copper layer is additionally etched to form conductive copper traces interconnecting selected ones of said solder pads.

3. The multilayer circuit board of claim 1, wherein said copper layer is additionally etched to form one layer of a distributed decoupling power plane connected to selected ones of said solder pads.

4. The multilayer circuit board of claim 1, wherein said circuit board has multiple alternating layers of conductive polymer and dielectric, said polymer traces interconnecting selected ones of said pads and said dielectric layer leaving said solder pads and selected ones of said tails exposed, and the solder mask sealingly covers the uppermost layer of said conductive polymer traces while leaving said solder pads exposed.

5. The multilayer circuit board of claim 4, wherein said circuit board has multiple alternating layers of conductive polymer traces and dielectric on both surfaces of said substrate.

6. The multilayer circuit board of claim 1, wherein the second side of said supporting substrate has deposited thereon a distributed decoupling system comprising two conductive layers separated by a thin dielectric layer.

7. The multilayer circuit board of claim 6, wherein said first conductive layer is copper connected to selected ones of said solder pads, said second conductive layer is conductive polymer connected to other selected ones of said solder pads, and a thin dielectric layer is interposed between said copper and conductive polymer layers to create a distributed decoupling capacitance over the surface of said circuit board.

8. The multilayer circuit board of claim 6, wherein said two conductive layers are conductive polymer connected to respective selected ones of said solder pads, and a thin dielectric layer is interposed between said two conductive polymer layers to create a distributed decoupling capacitance over the surface of said circuit board.

9. The multilayer circuit board of claim 1, wherein said circuit board contains at least one array of holes, said holes penetrating said solder pads to receive conductive leads of the circuit components so that said leads can be soldered to said solder pads.

10. The multilayer circuit board of claim 1, wherein said circuit board contains an array of undrilled solder pads for receiving surface mounted components.

11. The multilayer circuit board of claim 4, including a distributed decoupling system which comprises two conductive layers separated by a thin dielectric layer, said two conductive layers being conductive polymer connected to respective selected ones of said solder pads, a said thin dielectric layer interposed between said conductive polymer layers to create a distributed capacitance over the surface of said circuit board, the distributed decoupling system being deposited over said multiple alternating layers of conductive polymer and dielectric on one surface of said circuit board.

12. The multilayer circuit board of claim 11, wherein a layer of conductive polymer is deposited over said multiple alternating layers of conductive polymer and dielectric on the second side of said circuit board to reduce decoupling effects and interference between underlying circuit traces.