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Thermally stable hot melt moisture-cure polyurethane adhesive composition

  • US 4,775,719 A
  • Filed: 01/29/1986
  • Issued: 10/04/1988
  • Est. Priority Date: 01/29/1986
  • Status: Expired due to Term
First Claim
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1. A hot melt thermosetting urethane adhesive composition having thermal stability that can be extruded as a hot melt adhesive to form an initially high green strength hot melt bond and can moisture cure to a rigid moisture cure polyurethane bond, which comprises:

  • (a) an effective green bonding amount of a film-forming thermoplastic ethylene-vinyl monomer copolymer wherein the vinyl monomer comprises an acrylate monomer or a vinyl ester of a carboxylic acid compound;

    (b) an effective amount of a liquid polyurethane prepolymer composition, having a viscosity of less than 25,000 cP at 25°

    C., comprising the reaction product of a polyfunctional hydroxy compound having a number average molecular weight of at least 1,000 and a polyfunctional isocyanate compound having an isocyanate functionality of about 2 or more at a ratio of hydroxyl groups to isocyanate groups of 0.1 to 0.7;

    1, sufficient to form a rigid moisture-cure bond;

    (c) a phenol-free, aromatic or aliphatic-aromatic polymer tackifier comprising a monomer selected from the group consisting of a C4-6 diene, a styrenic monomer, an indene monomer, dicyclopentadiene, and mixtures thereof; and

    (d) about 0 to 5 wt-% of an antioxidant.

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