Modular image sensor structure

• US 4,775,895 A
• Filed: 10/30/1986
• Issued: 10/04/1988
• Est. Priority Date: 12/13/1985
• Status: Expired due to Fees

• Current Assignee: Heimann GmbH
• Original Assignee: Heimann GmbH
• Inventors: Heimann, Bernd, Dennhoven, Manfred, Traupe, Ulrich
• Primary Examiner(s): COLES, EDWARD L
• Application Number:
  US06/924,973
• Time in Patent Office: 705 Days
• Field of Search: 358/280, 358/294, 358/213, 358/293, 358/285, 358/213.11, 358/213.12, 358/213.15
• US Class Current: 358/482
• CPC Class Codes: H01L 27/14665 Imagers using a photoconductor layer
• CPC Class Codes: H04N 1/0308 characterised by the design of the photodetectors, e.g. shape
• CPC Class Codes: H04N 1/031 the photodetectors having a one-to-one and optically positive correspondence with the scanned picture elements, e.g. linear contact sensors

Abstract

An image sensor module for reading optical information on an original and converting the information into electrical signals, has a row of opto-electrical sensors, each sensor having associated processing circuitry integrated therewith in the module. The drive module functions as the substrate for the sensors as well, which are separated from the substrate by an insulator layer, having openings therein for making electrical connection between the substrate and the sensor.

Claims

1. A contact image sensor line comprising:

a plurality of drive modules disposed in succession, each drive module having at least one module sensor line of opto-electrical sensors thereon having a structure consisting of a plurality of layers disposed on said drive module as a substrate, with an insulating layer being disposed between said drive module and said sensors with an electrical connection therethrough, said drive modules being disposed successively along said contact image sensor line with said module sensor lines in combination forming said contact image sensor line.

2. An image sensor line as claimed in claim 1, wherein said modules comprising said line are disposed offset relative to each other.

3. An image sensor line as claimed in claim 1, wherein each drive module further comprises an MOS input protective structure and means for temporarily attaching said MOS input protective structure to said drive module.

4. An image sensor line comprising:

a plurality of drive modules disposed in succession, each drive module having at least one module sensor line thereon consisting of a plurality of picture elements integrated on said drive module using said drive module as a substrate, said drive module having an insulating layer thereon with a plurality of electrical contacts for the respective picture elements extending therethrough electrically connecting said picture elements to said substrate, and each picture element including in sequence a picture element electrode electrically connected to said contact, a photoconductive layer disposed above said picture element electrodes, and a transparent cover electrode over said photoconductive layer, said drive modules being disposed successively along said contact image sensor line with said module sensor lines in combination forming said contact image sensor line.

5. An image sensor line as claimed in claim 4, wherein said photoconductive layer consists of a-Si:

H.

6. An image sensor line comprising:

a plurality of drive modules disposed in succession, each drive module having a plurality of module sensor lines of opto-electrical sensors thereon having a structure consisting of a plurality of layers disposed on said drive module as a substrate, with an insulating layer being disposed between said drive module and said sensors with an electrical connection therethrough, said drive modules being disposed successively along said contact image sensor line with said module sensor lines in combination forming said contact image sensor line.