Lenses and lens arrays

• US 4,776,868 A
• Filed: 12/17/1986
• Issued: 10/11/1988
• Est. Priority Date: 09/09/1985
• Status: Expired due to Term

• Current Assignee: Corning Glass Works Inc. (Corning Incorporated)
• Original Assignee: Corning Glass Works Inc. (Corning Incorporated)
• Inventors: Trotter, Donald M. Jr., Whitman, Arthur J.
• Primary Examiner(s): Schor, Kenneth M.
• Application Number:
  US06/942,841
• Time in Patent Office: 664 Days
• Field of Search: 264/1.1, 264/1.2, 264/1.4, 264/81, 264/309, 264/299, 264/1.7, 264/1.9, 65/18.2, 65/18.3, 65/37, 65/99.1, 65/66, 65/122, 350/417, 350/435, 350/412, 350/320, 350/96.18, 427/162, 427/282
• US Class Current: 65/17.4
• CPC Class Codes: B29C 41/02 for making articles of definite length, i.e. discrete articles
• CPC Class Codes: B29D 11/00278 Lenticular sheets B29D11/00269 takes precedence
• CPC Class Codes: C23C 14/0005 Separation of the coating from the substrate
• CPC Class Codes: C23C 14/044 using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
• CPC Class Codes: G02B 3/0012 characterised by the manufacturing method
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: Y10S 359/90 Methods

Abstract

This invention relates to a method for preparing a lens or a lens array and apparatus for carrying out the method. The method comprises directing, in line of sight in a vacuum, the vapor of a substance, which is solid and transparent at ambient temperature, from a source of that vapor through a hole in a mask to form a deposit on a substrate. The mask is so positioned between the vapor source and the substrate that obscuration by the solid portions of the mask around the hole causes the deposit to assume a curved surface and function as a lens.

Claims

1. In a method for forming at least one deposit upon a substrate which comprises directing, in a vacuum, a vapor phase of a substance, which substance is solid and transparent at ambient temperature, from at least one means providing a source of said substance in vapor phase through at least one hole in a mask to strike and essentially instantaneously solidify upon a substrate, the improvement comprising, spacing said mask between said substrate and said means providing a source and providing the mask with sufficient thickness such that a converging cone of said substance in vapor form is passed into said hole and a diverging cone of said substance is directed from said hole to said substrate to thereby deposit a lens and solid portions of said mask surrounding said hole intercept the directed substance and cause said deposit to assume a smooth convex surface facing said source to thereby form a lens with a convex face.

2. A method according to claim 1 wherein said mask has a plurality of holes therein through which said vapor phase is directed to form a plurality of deposits of said substance on said substrate having convex surfaces facing said source to form a plurality of lenses.

3. A method according to claim 2 wherein the plurality of holes in said mask are in an array and the plurality of deposits comprise a lens array.

4. A method according to claim 1 wherein a plurality of masks having at least one hole which is in alignment with a hole in each of the plurality of masks are spaced between said substrate and said source, such that the solid portions of the surfaces of said masks facing said source intercept said source causing said deposit to assume a convex surface facing said source to form a lens.

5. A method according to claim 4 wherein the total distance between the surface of the mask facing the vapor source of the mask closest to the vapor source and the surface of the mask facing away from the vapor source of the mask farthest from the vapor source must be substantially smaller than the distance between the substrate and the mask closest to the substrate.

6. A method according to claim 1 wherein the size of said hole ranges between 0.05-0.3 mm in diameter.

7. A method according to claim 1 wherein said mask is spaced apart from said substrate at a distance about 10-20 times the diameter of the hole in said mask.

8. A method according to claim 1 wherein said mask and said substrate are spaced about 50-500 mm from said source.