Microelectronic burn-in system
First Claim
1. An apparatus for thermally stressing microelectronic components by thermally exciting the components, and comprising:
- a first circuit panel having test circuitry defined thereon;
at least one microelectronic component socket interconnected to the test circuitry on the first circuit panel, each socket having a mating face and having component lead contact elements disposed thereon;
a second circuit panel disposed adjacent the mating face of the socket;
a heating element disposed externally on the socket on the second circuit panel adjacent the component lead contact elements; and
thermal insulation surrounding the heating element on the second circuit panel and the sockets and the microelectronic components disposed in the sockets to confine heat from the heating element to the immediate vicinity of the components, whereby the first and second circuit panels can be respectively connected to signal and power sources, and microelectronic components which have been thermally excited by power delivered to the heating element can be tested by electrical signals transmitted through the sockets.
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Accused Products
Abstract
An apparatus for use in thermally testing electrical components, especially microelectronic components, such as dual in-line integrated circuit packages is disclosed. The apparatus is for use in testing the electrical performance of components when subjected to elevated temperature. Heat is applied through resistive heating elements disposed adjacent the electrical components which are mounted in electrical connectors, such as DIP sockets. Separate test and heater printed circuit boards attachable to conventional edge connectors can be employed. Insulation completely surrounds the sockets and the electrical components. Heating elements having a ferromagnetic-nonferromagnetic layer construction and exhibiting constant temperature regulation at a characteristic Curie point can be employed.
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Citations
10 Claims
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1. An apparatus for thermally stressing microelectronic components by thermally exciting the components, and comprising:
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a first circuit panel having test circuitry defined thereon; at least one microelectronic component socket interconnected to the test circuitry on the first circuit panel, each socket having a mating face and having component lead contact elements disposed thereon; a second circuit panel disposed adjacent the mating face of the socket; a heating element disposed externally on the socket on the second circuit panel adjacent the component lead contact elements; and thermal insulation surrounding the heating element on the second circuit panel and the sockets and the microelectronic components disposed in the sockets to confine heat from the heating element to the immediate vicinity of the components, whereby the first and second circuit panels can be respectively connected to signal and power sources, and microelectronic components which have been thermally excited by power delivered to the heating element can be tested by electrical signals transmitted through the sockets. - View Dependent Claims (2, 3, 4, 5)
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6. For use in thermally testing microelectronic circuit components mounted in corresponding sockets located in an array and electrically connected to test circuitry, each socket having component lead contact elements disposed thereon;
- a heating apparatus comprising a circuit board configured for deposition adjacent the lead contact elements between each socket and the corresponding microelectronic component and having heating elements on the circuit board, each heating element being disposable adjacent the lead contact elements, the heating elements being electrically joined to contact traces adjacent one edge of the circuit board for interconnection to a source of electrical power.
- View Dependent Claims (7, 8, 9, 10)
Specification