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Microelectronic burn-in system

  • US 4,777,434 A
  • Filed: 03/09/1987
  • Issued: 10/11/1988
  • Est. Priority Date: 10/03/1985
  • Status: Expired due to Fees
First Claim
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1. An apparatus for thermally stressing microelectronic components by thermally exciting the components, and comprising:

  • a first circuit panel having test circuitry defined thereon;

    at least one microelectronic component socket interconnected to the test circuitry on the first circuit panel, each socket having a mating face and having component lead contact elements disposed thereon;

    a second circuit panel disposed adjacent the mating face of the socket;

    a heating element disposed externally on the socket on the second circuit panel adjacent the component lead contact elements; and

    thermal insulation surrounding the heating element on the second circuit panel and the sockets and the microelectronic components disposed in the sockets to confine heat from the heating element to the immediate vicinity of the components, whereby the first and second circuit panels can be respectively connected to signal and power sources, and microelectronic components which have been thermally excited by power delivered to the heating element can be tested by electrical signals transmitted through the sockets.

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