Microelectronic burn-in system

• US 4,777,434 A
• Filed: 03/09/1987
• Issued: 10/11/1988
• Est. Priority Date: 10/03/1985
• Status: Expired due to Fees

• Current Assignee: AMP Incorporated (Johnson Controls International plc)
• Original Assignee: AMP Incorporated (Johnson Controls International plc)
• Inventors: Miller, Vernon R., Roberts, Lincoln E.
• Primary Examiner(s): Eisenzopf, Reinhard J.
• Assistant Examiner(s): BURNS, WILLIAM
• Application Number:
  US07/023,892
• Time in Patent Office: 582 Days
• Field of Search: 214/200, 214/201, 214/209, 214/504, 214/505, 324/158 P, 324/158 F, 324/73 PC, 361/385, 374/45, 374/57, 340/597
• US Class Current: 324/750.05
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04

Abstract

An apparatus for use in thermally testing electrical components, especially microelectronic components, such as dual in-line integrated circuit packages is disclosed. The apparatus is for use in testing the electrical performance of components when subjected to elevated temperature. Heat is applied through resistive heating elements disposed adjacent the electrical components which are mounted in electrical connectors, such as DIP sockets. Separate test and heater printed circuit boards attachable to conventional edge connectors can be employed. Insulation completely surrounds the sockets and the electrical components. Heating elements having a ferromagnetic-nonferromagnetic layer construction and exhibiting constant temperature regulation at a characteristic Curie point can be employed.

Claims

1. An apparatus for thermally stressing microelectronic components by thermally exciting the components, and comprising:

a first circuit panel having test circuitry defined thereon;

at least one microelectronic component socket interconnected to the test circuitry on the first circuit panel, each socket having a mating face and having component lead contact elements disposed thereon;

a second circuit panel disposed adjacent the mating face of the socket;

a heating element disposed externally on the socket on the second circuit panel adjacent the component lead contact elements; and

thermal insulation surrounding the heating element on the second circuit panel and the sockets and the microelectronic components disposed in the sockets to confine heat from the heating element to the immediate vicinity of the components, whereby the first and second circuit panels can be respectively connected to signal and power sources, and microelectronic components which have been thermally excited by power delivered to the heating element can be tested by electrical signals transmitted through the sockets.

2. The apparatus of claim 1 wherein the socket has two spaced rows of lead contact elements, the heating element being disposed between the two spaced rows.

3. The apparatus of claim 2 wherein the mating face of the socket comprises a channel extending between the two spaced rows, the heating element being disposed in the channel.

4. The apparatus of claim 3 wherein the second circuit panel has a plurality of openings through which the sockets with the spaced rows of contacts extend.

5. The apparatus of claim 1 wherein the thermal insulation is disposed on outwardly facing surfaces of each circuit panel and between the circuit panels.

6. For use in thermally testing microelectronic circuit components mounted in corresponding sockets located in an array and electrically connected to test circuitry, each socket having component lead contact elements disposed thereon;

a heating apparatus comprising a circuit board configured for deposition adjacent the lead contact elements between each socket and the corresponding microelectronic component and having heating elements on the circuit board, each heating element being disposable adjacent the lead contact elements, the heating elements being electrically joined to contact traces adjacent one edge of the circuit board for interconnection to a source of electrical power.

7. The apparatus of claim 6 wherein the lead contact elements are aligned in at least one row, the heating apparatus being configured to dispose the heating elements adjacent each row.

8. The apparatus of claim 7 for use in thermally testing dual in-line integrated circuit components.

9. The apparatus of claim 6 further comprising thermal insulation separating the heating elements and the microelectronic components from the one edge of the substrate for interconnection to the source of electrical power.

10. The apparatus of claim 6 wherein the heating elements comprise elements having a nonferromagnetic electrically conductive core and a ferromagnetic outer layer, the heating elements exhibiting a characteristic Curie temperature at which the outer layer changes from a ferromagnetic phase to a paramagnetic phase.