Method and apparatus for controlling electrostatic charges in fluidized beds

• US 4,779,163 A
• Filed: 03/05/1984
• Issued: 10/18/1988
• Est. Priority Date: 07/23/1982
• Status: Expired due to Fees

• Current Assignee: Procedyne Corp.
• Original Assignee: Procedyne Corp.
• Inventors: Bickford, Karin, Japka, Joseph E., Roaper, Robert B.
• Primary Examiner(s): Hix, L. T.
• Assistant Examiner(s): Rutledge, D.
• Application Number:
  US06/586,021
• Time in Patent Office: 1,688 Days
• Field of Search: 361/212, 361/215, 361/220, 361/226, 219/359, 219/360, 219/369, 219/388, 219/390, 219/399, 219/406, 219/407, 219/430, 219/439, 34/10, 34/57 A, 34/57 C, 165/104.16, 432/15, 432/18, 432/27, 432/58, 432/261, 373/109, 373/110, 374/45, 374/57, 324/158 F
• US Class Current: 361/212
• CPC Class Codes: B01J 2208/00734 Controlling static charge
• CPC Class Codes: B01J 8/1809 Controlling processes
• CPC Class Codes: B01J 8/1872 Details of the fluidised bed reactor B01J8/1836 takes precedence
• CPC Class Codes: G01N 25/00 Investigating or analyzing materials by the use of thermal means G01N3/00 - G01N23/00 take precedence
• CPC Class Codes: G01N 3/60 Investigating resistance of materials, e.g. refractory materials, to rapid heat changes thermal testing of structures or apparatus G01M99/002
• CPC Class Codes: G01R 29/24 Arrangements for measuring quantities of charge
• CPC Class Codes: H05F 3/02 by means of earthing connections

Abstract

A fluidized bed method and apparatus involving a grounded electrically conductive bed for controlling or eliminating electrostatic charges therein and high surface area charge dissipators.

Claims

1. A fluidized bed device for thermal operations on a workpiece adapted to minimize electrostatic charge comprising:

at least one enclosure having means for expanding a mass of solid particles therein, said enclosure having a means for supporting a workpiece disposed therein comprising a basket means, having surfaces adapted to allow the passage of fluidized particles to pass therethrough;

said surfaces being in electrical communication with an electrical ground;

a mass of solid particles within the enclosure, at least some of said particles selected from the group consisting of electrically conductive and semi-conductive materials;

means for contacting the expanded mass with the conductive surfaces; and

means for controlling the temperature within said enclosure.

2. The fluidized bed device recited in claim 1 wherein:

the expanded mass contains at least 1% wt. carbon particles.

3. The fluidized bed device recited in claim 1 wherein:

the expanded mass contains at least some particles selected from the group consisting of metals and metal alloys.

4. The fluidized bed device recited in claim 1 wherein:

the expanded mass contains at least some aluminum oxide sand particles.

5. The fluidized bed device recited in claim 1 wherein:

the expanded mass contains at least some Rutile particles.

6. The fluidized bed device recited in any one of claims 1, 2, 3 or 4 wherein:

the means for contacting the expanded mass with electrical ground comprises a plurality of grounded electrically conductive wires disposed within the enclosure so that they contact the expanded mass.

7. The fluidized bed device recited in claim 1 wherein a semiconductor device is disposed in the means for supporting a workpiece.

8. The fluidized bed device recited in claim 1 further comprising at least one dissipator mounted on the means for supporting a workpiece in order to dissipate static charges in the vicinity of the workpiece.

9. The fluidized bed device recited in claim 8 wherein the surfaces of the enclosure consist of electrically conductive surfaces.

10. The fluidized bed device recited in claim 9 wherein the particles consist of electrically conductive particles.

11. The fluidized bed device recited in claim 1 wherein:

the expanded mass contains at least some particles selected from the group consisting of titanium dioxide and titanium oxide with solute additions in particulate form of other metal oxide phases selected from the group consisting of ferrites, chromia, and alumina.

12. A device for thermal testing, which comprises:

a first and second enclosure each having means for producing an expanded mass of solid particles therein including at least some particles selected from the group consisting of conductive and semi-conductive materials;

support means for supporting a workplace within said enclosures;

means for adjusting the temperature in each enclosure;

means for contacting the expanded mass in each enclosure with electrical ground; and

electromechanical means for transporting the support means between the first and second enclosure.

13. A device for thermal testing as recited in claim 12 wherein:

the support means comprises an electrically conductive wire basket in communication with electrical ground having at least one dissipator affixed thereto for increasing the surface area in which particles may dissipate electrostatic build-up.

14. A fluidized bed device, which comprises:

at least one enclosure having means for producing an expanded mass of solid particles therein including at least some particles selected from the group consisting of conductive and semi-conductive materials;

means for contacting the expanded mass with electrical ground; and

means for controlling the temperature within said enclosure, wherein an electrically conductive means for supporting a workpiece comprises a wire basket comprising a plurality of intermeshed wires surrounding a workpiece, adapted to allow the passage of fluidized particles to pass therethrough;

further comprising a plurality of dissipators mounted on the means for supporting a workpiece in order to dissipate static charges in the vicinity of the workpiece and a plurality of dissipators mounted within the enclosure in electrical communication with the walls of the enclosure.

15. A method of thermal testing semiconductor devices comprising:

providing a fluidized bed of solid particulate matter;

placing the semiconductor devices in an electrically conductive workpiece holder which is disposed within the fluidized bed;

contacting the semiconductor devices with particles of the fluidized bed wherein at least some of the particles are electrically conductive materials;

dissipating electrostatic charge from the particles by contacting the particles with grounded conductive surface, wherein the surfaces comprise electrically conductive, grounded walls of the fluidized bed, electrically conductive, grounded, charge dissipating wires disposed in the fluidized bed, and the workpiece holder.