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Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture

  • US 4,780,795 A
  • Filed: 11/17/1987
  • Issued: 10/25/1988
  • Est. Priority Date: 04/28/1986
  • Status: Expired due to Term
First Claim
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1. In a hybrid integrated circuit, a planar capacitor comprising in combination:

  • (a) first and second coplanar metal film conductors, the first and second metal film conductors each having a plurality of closely, precisely spaced parallel portion and together forming a planar first fringe capacitor;

    (b) dielectric material including (1) a first portion disposed directly on and entirely coating the parallel portions of the first and second metal film conductors and (2) a second portion bounding both a first cavity and a second cavity substantially spaced from the first cavity;

    (c) end portions of the first and second metal film conductors extending into the first and second cavity, respectively, to form first and second terminals of the first fringe capacitor, the second portion of the dielectric material being sufficiently thick that the first and second cavities are large enough to contain first and second integrated circuit chips, respectively, the first and second integrated circuit chips including first and second bonding pads, respectively, and a first conductor connecting the first bonding pad to the end portion of the first metal film conductor, and a second conductor connecting the second bonding pad to the end portion of the second metal film conductor, the separation between the first and second metal film conductors being sufficiently high that the first fringe capacitor forms a high voltage isolation barrier between the first and second integrated circuit chips, the spacing between the first and second cavities being great enough to provide a high voltage electrical isolation between the first and second integrated circuit chips.

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