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Leadless chip carrier for RF power transistors or the like

  • US 4,783,697 A
  • Filed: 09/02/1986
  • Issued: 11/08/1988
  • Est. Priority Date: 01/07/1985
  • Status: Expired due to Term
First Claim
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1. A leadless chip carrier suitable for a power semiconductor device having a plurality of terminals, said carrier comprising in combination:

  • a substantially planar substrate of insulating material having two major surfaces and a thickness;

    a conductive pattern on one of said major surfaces having at least a first, second, and third pad for receiving a semiconductive device on one pad thereof;

    a contact pattern on the other of said major surfaces having at least a first, second, and third area; and

    distributed interconnecting portions for electrically connecting the first, second, and third pads of the conductive pattern with their associated first, second, and third areas of the contact pattern, whereby said contact pattern permits leadless electrical connection of the chip carrier to accompanying external circuitry, and said distributed interconnecting portions provide wide paths for currents flowing between said conductive pattern and said contact pattern.

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