IC processed piezoelectric microphone

• US 4,783,821 A
• Filed: 11/25/1987
• Issued: 11/08/1988
• Est. Priority Date: 11/25/1987
• Status: Expired due to Term

• Current Assignee: Regents of the University of California (University of California)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Muller, Richard S., Kim, Eun S.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Byrd, Danita R.
• Application Number:
  US07/125,375
• Time in Patent Office: 349 Days
• Field of Search: 381/173, 381/190, 381/202, 381/203, 181/157, 181/167, 181/168, 181/173, 181/174, 181/170, 310/324, 29/25.35, 427/100
• US Class Current: 381/173
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A miniature diaphragm pressure transducer. A thin diaphragm of silicon nitride has an upper face covered by a zinc-oxide piezoelectric film encapsulated in chemical vapor deposited silicon dioxide. A series of annular, basically concentric, polysilicon electrodes are provided in the silicon dioxide between the piezoelectric film and the diaphragm and in contact with the piezoelectric film. A series of annular, basically concentric, aluminum electrodes are on the opposite side of the piezoelectric film from the polysilicon electrodes and are aligned with the polysilicon electrodes; they lie over the silicon dioxide, and are in contact with the piezoelectric film.

Claims

1. A miniature diaphragm pressure transducer, comprising:

a thin diaphragm of silicon nitride having an upper face,

a zinc oxide piezoelectric film encapsulated in chemical vapor deposited silicon dioxide, covering said upper face,

a series of annular, basically concentric, polysilicon electrodes in said silicon dioxide between said piezoelectric film and said diaphragm and in contact with said piezoelectric film, and

a series of annular, basically concentric, aluminum electrodes on the opposite side of said piezoelectric film from said polysilicon electrodes, aligned with said polysilicon electrodes, over said silicon dioxide, and in contact with said piezoelectric film.

2. The transducer of claim 1 wherein the area of said diaphragm is 5-15 mm² and the thickness is only about 2 μ

m.

3. The transducer of claim 1 wherein the piezoelectric film is about 0.3 μ

m thick.

4. A miniature diaphragm pressure transducer, comprising:

a diaphragm of silicon nitride based on a silicon wafer with a surface layer of thermal silicon dioxide, said diaphragm having an upper face,

a first chemically vapor deposited (CVD) layer of silicon dioxide covering said upper face,

a series of annular, basically concentric, polysilicon electrodes over said first layer of silicon dioxide,

a second CVD layer of silicon dioxide covering said polysilicon electrodes,

a zinc oxide piezoelectric film covering said second layer,

a third CVD layer of silicon dioxide covering said piezoelectric film,

a series of annular, basically concentric, aluminum electrodes on the opposite side of said piezoelectric film from said polysilicon electrodes, aligned with said polysilicon electrodes, over said third layer of silicon dioxide, and in contact with said piezoelectric film.

5. The transducer of claim 4 wherein said silicon nitride has an area of 5-15 mm² and a thickness of about 2 μ

m.