Trench etch process for a single-wafer RIE dry etch reactor
First Claim
1. A process for etching a trench in a substrate, comprising the steps of:
- etching a trench in a predetermined trench location of said substrate by means of a plasma source of etchants and ions;
selectively depositing materials on the sidewalls of said trench to control the profile of the trench being etched.
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Accused Products
Abstract
A plasma dry etch process for trench etching in single slice RIE etch reactors wherein a selective sidewall passivation is accomplished to control the profile of the trench being etched. The process comprises methods of passivating the sidewall by passivation on a molecular scale and by passivation by a veneer type passivation comprising buildup of a macroscopic residue over the surface of the sidewall. Several methods are disclosed for forming and shaping the passivating layers (both mono-atomic and bulk). By carefully controlling the composition and shape of the sidewall passivating veneer in conjunction with other etch factors, the desired trench profiles can be achieved.
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Citations
29 Claims
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1. A process for etching a trench in a substrate, comprising the steps of:
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etching a trench in a predetermined trench location of said substrate by means of a plasma source of etchants and ions; selectively depositing materials on the sidewalls of said trench to control the profile of the trench being etched.
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2. A process for etching a trench in silicon, comprising-the steps of:
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etching a trench in a predetermined trench location of said silicon substrate by means of a plasma source of silicon etchants and ions; selectively depositing materials on the sidewalls of said trench to control the profile of the trench being etched. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A process for etching a trench in a silicon substrate, comprising the steps of:
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etching a trench in a predetermined trench location of said silicon substrate by means of a plasma source of ions; passivating the sidewalls of the trench by deposition of materials on the sidewalls to control the profile of the trench being etched. - View Dependent Claims (27, 28, 29)
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Specification