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Subcutaneous housing assembly

  • US 4,785,827 A
  • Filed: 01/28/1987
  • Issued: 11/22/1988
  • Est. Priority Date: 01/28/1987
  • Status: Expired due to Term
First Claim
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1. A housing assembly adapted for receiving electronic circuitry, which housing assembly can be sealed shut and used subcutaneously, said housing assembly comprising:

  • a container sub assembly and a base sub assembly each comprising;

    a ceramic portion having a periphery and inner and outer surfaces melting at said periphery anda continuous metal sealing flange having first and second portions, said first portion being bonded to said ceramic portion along its entire length around said periphery and said second portion being spaced from said ceramic portion;

    the ceramic portion of said container sub assembly being dish-like with its inner surface defining a cavity, and having a plurality of electric leads brazed to and extending therethrough between said inner and outer surfaces; and

    said second portions of said sealing flanges being adapted to be positioned closely adjacent with the inner surfaces of said ceramic portions of said sub assemblies facing each other and to be bonded together entirely around said sealing flanges.

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