Process for making a hermetic low cost pin grid array package
First Claim
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1. A process for the assembling of a hermetic low cost pin grid array (PGA) semiconductor die package comprising the steps of:
- providing an insulative substrate having a central die bonding area and a periphery, and a conductive pattern comprising a plurality of conductive material traces extending from the central die bonding area at their proximal ends to the periphery at their distal ends;
bonding a semiconductor die having a plurality of bonding pads thereon to the central die bonding area;
electrically connecting the bonding pads of the semiconductor die to the proximal ends of the conductive material traces;
hermetically sealing a cap onto the insulative substrate wherein the cap covers the semiconductor die and the proximal ends of the conductive material traces, leaving exposed the distal ends of the traces; and
affixing leads to the distal ends of the conductive material traces after the cap is hermetically sealed to the substrate, whereby the leads are in a position perpendicular to the conductive material traces,in the absence of a plastic encapsulation step.
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Abstract
A process for making hermetic, low cost pin grid array (PGA) semiconductor die packages. The process involves die bonding a semiconductor die or integrated circuit chip to a substrate having an interconnect or metallization pattern thereon. The die is electrically connected to the pattern and then the die and the inner bonds are hermetically sealed inside a cap that is smaller than the substrate so that the ends of the metallization pattern are exposed. The leads are then electrically connected, such as by solder or other technique to the exposed ends of the pattern.
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Citations
19 Claims
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1. A process for the assembling of a hermetic low cost pin grid array (PGA) semiconductor die package comprising the steps of:
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providing an insulative substrate having a central die bonding area and a periphery, and a conductive pattern comprising a plurality of conductive material traces extending from the central die bonding area at their proximal ends to the periphery at their distal ends; bonding a semiconductor die having a plurality of bonding pads thereon to the central die bonding area; electrically connecting the bonding pads of the semiconductor die to the proximal ends of the conductive material traces; hermetically sealing a cap onto the insulative substrate wherein the cap covers the semiconductor die and the proximal ends of the conductive material traces, leaving exposed the distal ends of the traces; and affixing leads to the distal ends of the conductive material traces after the cap is hermetically sealed to the substrate, whereby the leads are in a position perpendicular to the conductive material traces, in the absence of a plastic encapsulation step. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A process for the assembling of a hermetic low cost pin grid array (PGA) semiconductor die package comprising the steps of:
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providing a ceramic substrate having a central die bonding area, a plurality of lead holes at the periphery of the substrate piercing the substrate and a conductive pattern comprising a plurality of conductive material traces extending from the central die bonding area at their proximal ends to the lead holes at their distal ends; bonding a semiconductor die having a plurality of bonding pads thereon to the central die bonding area; electrically connecting the bonding pads of the semiconductor die to the proximal ends of the conductive material traces; hermetically sealing a cap onto the ceramic substrate wherein the cap covers the semiconductor die and the proximal ends of the conductive material traces, leaving exposed the distal ends of the traces and the lead holes; placing leads in the lead holes in a position perpendicular to the conductive metal traces; and electrically affixing leads placed in the lead holes in the distal ends of the conductive material traces after the cap is hermetically sealed to the substrate, in the absence of a plastic encapsulation step. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A process for the assembling of a hermetic low cost pin grid array (PGA) semiconductor die package comprising the steps of:
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providing a ceramic substrate having a central die bonding area, a plurality of lead holes at the periphery of the substrate piercing the substrate and a conductive pattern comprising a plurality of conductive material traces extending from the central die bonding area at their proximal ends to the lead holes at their distal ends; bonding a semiconductor die having a plurality of bonding pads thereon to the central die bonding area; electrically connecting the bonding pads of the semiconductor die to the proximal ends of the conductive material traces; hermetically sealing a cap onto the ceramic substrate wherein the cap covers the semiconductor die and the proximal ends of the conductive material traces, leaving exposed the distal ends of the traces and the lead holes; placing leads into the lead holes in a position perpendicular to the conductive metal traces after the cap is hermetically sealed to the substrate; and soldering the leads in the lead holes to the distal ends of the conductive material traces, in the absence of a plastic encapsulation step. - View Dependent Claims (18, 19)
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Specification