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In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection

  • US 4,793,895 A
  • Filed: 01/25/1988
  • Issued: 12/27/1988
  • Est. Priority Date: 01/25/1988
  • Status: Expired due to Term
First Claim
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1. An apparatus for monitoring the conductivity of an exposed surface of a workpiece during polishing in a lapping machine, comprising:

  • a plurality of isolated electrode means coupled to the lapping machine, at least one of said plurality of isolated electrode means contacting a surface of the workpiece; and

    means for monitoring current flow between said plurality of isolated electrode means, said current indicating the amount of conductive material at the exposed surface of the substrate.

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