Structure of joining printed circuit boards and process for producing the same

• US 4,795,079 A
• Filed: 03/27/1986
• Issued: 01/03/1989
• Est. Priority Date: 03/29/1985
• Status: Expired due to Term

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Yamada, Akira
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US06/844,822
• Time in Patent Office: 1,013 Days
• Field of Search: 228/180.2, 228/179, 228/254, 361/405, 361/406, 361/408, 361/412, 174/88 R, 439/485, 439/874, 439/875, 439/876
• US Class Current: 228/179.1
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0212 Printed circuits or mounted components having integral heating means
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/09172 Notches between edge pads
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10477 Inverted
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0415 Small preforms other than balls, e.g. discs, cylinders or pillars
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24777 Edge feature
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A structure of joining two printed circuit boards with solder. A reserve solder layer is applied on a pattern of first joint leads of the printed circuit on a base plate of the first board. A pattern of high thermal conductivity similar to the pattern of second joint leads of the second printed circuit board, is formed on the opposite or back surface of the base plate thereof substantially superposed with the second joint leads. To join the first and second boards, the second board is turned upside down and then the second joint lead pattern is put on the solder layer in registry with the first joint lead pattern of the first board. And it is at a point on each patch of the thermal conductivity pattern that heat is then applied thereto to obtain the structure between the joint leads of the two printed circuit boards.

Claims

1. A structure for joining printed circuit boards through a thermal welding electrically conductive material at joint pattern portions thereof, comprising:

(a) a first printed circuit board having a first joint pattern formed on a base plate, whereby said thermal welding electrically conductive material is applied on said first joint pattern of said first printed circuit board; and

(b) a second printed circuit board having a second joint pattern formed on a base plate, said second printed circuit board having a pattern for improving thermal conductivity formed on a surface of said base plate opposite to that on which said second joint pattern is formed and in an area almost coincident to at least said second joint pattern area.

2. A structure according to claim 1, wherein said second printed circuit board is made of a flexible printed circuit board using a film base whose thickness is no more than 0.3 mm.

3. A structure according to claim 1, wherein said pattern for improving thermal conductivity formed on said second printed circuit board is a dummy pattern.

4. A structure according to claim 1, wherein said pattern for improving thermal conductivity formed on said second printed circuit board is connected to said second joint pattern by through holes.

5. A structure according to claim 1, wherein said second printed circuit board comprises a plurality of said second joint patterns and each joint pattern is formed to a comb tooth shaped extension.

6. A structure according to claim 5, wherein said second joint pattern is connected to said pattern for improving thermal conductivity by through holes.

9. A structure according to claim 1, wherein said thermal welding electrically conductive material is made of solder.

7. A process for joining two printed circuit boards at joint pattern portions thereof with a thermal welding electrically conductive material therebetween by applying heat from an exterior thereof to melt said conductive material, comprising the steps of:

(a) using a first printed circuit board previously coated with said thermal welding electrically conductive material in a first joint pattern portion of a base plate and a second printed circuit board having a pattern for improving thermal conductivity formed on a back surface of a base plate having a front surface with a second joint pattern portion, said pattern for improving thermal conductivity being formed in at least an area on said back surface substantially superposed to said second joint pattern portion;

(b) putting said first joint pattern portion of said first printed circuit board on said second joint pattern portion of said second printed circuit board; and

(c) applying heat to said pattern for improving thermal conductivity of said second printed circuit board to melt said thermal welding electrically conductive material, whereby said first joint pattern portion and said second joint pattern portion are joined with each other.

10. A method according to claim 7, wherein said thermal welding electrically conductive material is made of solder.

8. A process for joining two printed circuit boards with a thermal welding electrically conductive material between joint pattern portions thereof by applying heat from an exterior thereof to melt said electrically conductive material so that said joint pattern portions are joined with each other, comprising the steps of:

(a) using a first printed circuit board previously coated with said thermal welding electrically conductive material in a first joint pattern portion on a base plate, and a second printed circuit board having a pattern for improving thermal conductivity formed on a surface of a base plate opposite to that having a second joint pattern portion, said pattern for improving thermal conductivity being formed in at least an area on said surface substantially superposed to said second joint pattern portion;

(b) putting said first joint pattern portion of said first printed circuit board on said second joint pattern portion of said second printed circuit board; and

(c) continuing to apply heat to said pattern for improving thermal conductivity of said second printed circuit board; and

(d) feeding new thermal welding electrically conductive material while being melted to said first and second joint pattern portions positions until they are joined.

11. A method according to claim 8, wherein said thermal welding electrically conductive material is made of solder.