System for inspecting pattern defects of printed wiring boards
First Claim
1. A method of inspecting pattern defects of printed wiring boards of the same type by comparing pattern data of said printed wiring boards, said method comprising the steps of:
- placing a first printed wiring board having positioning marks being in prescribed positional relation to positioning marks of a wiring pattern on a table driven in a sub scanning direction;
reading said marks of said first printed wiring board to find the amount of deviation of said first printed wiring board with respect to a reference position in an inspection system and thereafter performing image acquisition of an inspected area of said first printed wiring board by sequential scanning thereby to store obtained pattern data in a memory unit;
placing a second printed wiring board having the same positioning marks as said marks on said table;
reading said marks of said second printed wiring board thereby to find the amount of deviation of said second printed wiring board with respect to said reference position in said inspection system in order to find an amount of relative misregistration between said second printed wiring board with respect to said first printed wiring board by comparing the read marks of said first and second printed wiring boards; and
controlling reading of pattern data of said first printed wiring board stored in said memory unit on the basis of said amount of said relative misregistration when said inspected area of said second printed wiring board is subjected to image acquisition while controlling arrangement of said read pattern data thereby to compare both pattern data in pixel data correspondence on the basis of pattern data of said second printed wiring board obtained by sequential scanning.
1 Assignment
0 Petitions
Accused Products
Abstract
Printed wiring boards (PWBs) applied to this inspection system are previously formed with marks in prescribed positional relation to wiring patterns. Deviation of PWBs with respect to absolute coordinates of the inspection system is detected by reading the marks. The PWBs are sequentially set one by one on a movable table, to be subjected to image acquisition of the marks and inspected areas. A first PWB is image-acquisited whereby obtained binary image data of the inspected area are stored in a memory unit. Thereafter a second PWB is image-acquisited, and in advance to the image acquisition of its inspected area, relative misregistration of the both PWBs is found by deviation data on respective marks of the first and second PWBs. The binary image data of the first PWB is read from the memory unit on the basis of the binary image data of the second PWB. When the binary image data of the first PWB are read, positional correction, i.e., time base correction is performed on the read data to correspond to pixels of the second PWB under image acquisition on the basis of data on the previously found amount of relative misregistration. The data on corresponding pixels of the both PWBs are compared with each other thereby to inspect difference between the patterns of the PWBs on the basis of the result of the comparison.
172 Citations
17 Claims
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1. A method of inspecting pattern defects of printed wiring boards of the same type by comparing pattern data of said printed wiring boards, said method comprising the steps of:
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placing a first printed wiring board having positioning marks being in prescribed positional relation to positioning marks of a wiring pattern on a table driven in a sub scanning direction; reading said marks of said first printed wiring board to find the amount of deviation of said first printed wiring board with respect to a reference position in an inspection system and thereafter performing image acquisition of an inspected area of said first printed wiring board by sequential scanning thereby to store obtained pattern data in a memory unit; placing a second printed wiring board having the same positioning marks as said marks on said table; reading said marks of said second printed wiring board thereby to find the amount of deviation of said second printed wiring board with respect to said reference position in said inspection system in order to find an amount of relative misregistration between said second printed wiring board with respect to said first printed wiring board by comparing the read marks of said first and second printed wiring boards; and controlling reading of pattern data of said first printed wiring board stored in said memory unit on the basis of said amount of said relative misregistration when said inspected area of said second printed wiring board is subjected to image acquisition while controlling arrangement of said read pattern data thereby to compare both pattern data in pixel data correspondence on the basis of pattern data of said second printed wiring board obtained by sequential scanning. - View Dependent Claims (2, 3, 4)
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5. A device for detecting misregistration of printed wiring boards supplied to an inspection system for said printed wiring boards with respect to reference points (X0, Y0) of two-dimensional perpendicular coordinates (X--Y) previously defined in said inspection system, said device comprising:
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image input means for sequentially scanning prescribed areas provided with circular marks formed in prescribed positions with respect to wiring patterns of said printed wiring boards and including said reference points (X0, Y0) thereby to convert patterns of said prescribed areas into time series signals; binarization means for binarizing said time series signals from said image input means along the contents of said prescribed areas; counter means for counting numbers of pixel signals concerning said marks outputted from said binarization means with respect to an X-axis direction and a Y-axis direction respectively; and updown switching control means for switching and controlling respective ones of said counter means from upcount to downcount or from downcount to upcount at points of time corresponding to said reference point (X0) in said X-axis direction and said reference point (Y0) in said Y-axis direction, amounts of deviation from said reference points (X0, Y0) being found on the basis of integrated counter data obtained in respective ones of said counter means. - View Dependent Claims (6)
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7. A device for inspecting pattern defects of printed wiring boards comprising:
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a table for receiving said printed wiring boards having positioning marks being in prescribed positional relation to wiring patterns; image pickup means for performing image acquisition of inspected areas of said printed wiring boards positioned on said table; binarization means for converting output signals from said image pickup means into binary data; storage means for storing pattern data on the basis of said binary data; deviation detecting means for reading said positioning marks thereby detecting amounts of deviation from reference coordinates in which said marks are to be positioned; misregistration operating means for operating and finding the amount of relative misregistration between a printed wiring board formerly placed on said table and another printed wiring board subsequently placed on said table on the basis of data on said amount of deviation found by said deviation detecting means; and misregistration correction control means for controlling reading from said storage means storing pattern data of said former printed wiring board on the basis of said data on said amounts of said relative misregistration obtained by said misregistration operating means to be in alignment, when said inspected area of said subsequently placed printed wiring board is subjected to image acquisition by said image pickup means and said binarization means outputs binary data, with said subsequent pattern data concerning said binary data while controlling arrangement of said read pattern data, thereby to compare both pattern data in pixel correspondence by said misregistration correction control means. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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8. A device for inspecting pattern defects of printed wiring boards comprising:
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a table for receiving said printed wiring boards having positioning marks being in prescribed positional relation to wiring patterns; image pickup means for performing image acquisition of inspected areas of said printed wiring boards positioned on said table; binarization means for converting output signals from said image pickup means into binary data; storage means for storing pattern data on the basis of said binary data; deviation detecting means for reading said positioning marks thereby detecting amounts of deviation from reference coordinates in which said marks are to be positioned; misregistration operating means for operating and finding the amount of relative misregistration between a printed wiring board formerly placed on said table and another printed wiring board subsequently placed on said table on the basis of data on said amount of deviation found by said deviation detecting means; misregistration correction control means for controlling reading from said storage means storing pattern data of said former printed wiring board on the basis of said data on said amounts of said relative misregistration obtained by said misregistration operating means to be in alignment, when said inspected area of said subsequently placed printed wiring board is subjected to image acquisition by said image pickup means and binarization means outputs binary data, with said subsequent pattern data concerning said binary data while controlling arrangement of said read pattern data, thereby to control both pattern data in pixel correspondence by said misregistration correction control means; and
means for data-compressing said binary data outputted from said binarization means and means for restoring said compressed data read from said storage means to said original binary data.
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Specification