Means for temperature control of heated surfaces

• US 4,799,543 A
• Filed: 11/12/1987
• Issued: 01/24/1989
• Est. Priority Date: 11/12/1987
• Status: Expired due to Fees

• Current Assignee: Iversen Arthur H
• Original Assignee: Arthur H. Iversen
• Inventors: Iversen, Arthur H., Whitaker, Stephen
• Primary Examiner(s): Yeung, James C.
• Application Number:
  US07/119,698
• Time in Patent Office: 439 Days
• Field of Search: 165/133, 165/135, 165/146, 165/80.4, 361/385, 361/401, 313/30, 357/68, 357/74, 357/80, 357/82
• US Class Current: 165/135
• CPC Class Codes: F28F 13/187 especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for providing an approximately uniform temperature distribution on a cold plate that has at least one of a non-uniform temperature distribution on its heated surface and non-uniform wall thickness separating the heated surface from the generally opposing fluid cooled surface. Low thermal conductivity material is selectively deposited on the fluid cooled surface of the cold plate such that the resulting local thermal resistivity combined with the corresponding local heat flux results in an approximately constant temperature over the heated surface on the cold plate.

Claims

1. A heat sink structure including a heated surface and further including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange surface in a fluid tight manner and including means for providing a flow of fluid to remove heat from said heat exchange surface, said heat sink structure having at least one of a variable wall thickness separating said heated surface from said fluid cooled surface and a variable distribution of heat flux on said heated surface, the improvement wherein said fluid cooled heat exchange surface includes:

means, disposed on said fluid cooled heat exchange surface in a variable manner commensurate with said variable wall thickness and said variable distribution of heat flux such that an approximately uniform temperature is achieved over said heated surface

2. In the apparatus of claim 1 the further improvement wherein said means comprises material of lower thermal conductivity than that of said heat sink structure.

3. In the apparatus of claim 2 the further improvement wherein said material of lower thermal conductivity is deposited in variable thickness on said fluid cooled heat exchange surface in such manner as to be responsive to said variations in said wall thickness and heat flux such that an approximately uniform surface temperature is achieved on said heated surface

4. A heat sink structure including a heated surface and including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by nucleate boiling, said heat sink structure having at least one of a variable wall thickness separating said heated surface from said liquid cooled surface and a variable distribution of heat flux on said heated surface, said liquid cooled heated surface further includes:

means, disposed on said heat exchange surface for forming pressure gradients in said liquid having a component perpendicular to said heat exchange surface without substantially impeding the relative velocity between said heat exchange surface and said Liquid, said component having a magnitude directly proportional to the square of the relative velocity between said heat exchange surface and said liquid, to facilitate removal of nucleate bubbles, the improvement wherein said liquid cooled heat exchange surface includes;

means, disposed on said liquid cooled heat exchange surface in a variable manner commensurate with said variable wall thickness and said variable distribution of heat flux such that an approximately uniform temperature is achieved over said heated surface.

5. In the apparatus of claim 4 the further improvement wherein said means comprises material of lower thermal conductivity than that of said heat sink structure.

6. In the apparatus of claim 5 the further improvement wherein said material of lower thermal conductivity is deposited in variable thickness on said liquid cooled heat exchange surface in such manner as to be responsive to said variations in said wall thickness and heat flux such that an approximately uniform surface temperature is achieved on said heated surface.

7. In the apparatus of claim 6 the further improvement wherein the interior surface of said heat sink structure contains one or more adjacent periodic curves across substantially the width of said structure and extending substantially the length of said structure and wherein a liquid coolant diverter is structured in close proximity to said heat exchange surface to provide predetermined liquid flow conditions at said anode heat exchange surface.

8. In the apparatus of claim 7 the further improvement wherein each said period or curve is provided with ducting for the alternate injection and removal of said liquid coolant.

9. In the apparatus of claim 8 the further improvement wherein said heat exchange surface is prepared with means disposed on said heat exchange surface for forming nucleate bubbles of predetermined size and distribution to thereby increase heat flux.

10. In the apparatus of claim 9 the further improvement wherein said means comprises cavities and said cavities have dimensions in the range of 0.002 mm to 0.2 mm, and said cavities being spaced apart on said heat exchange surface a distance ranging from 0.03 mm to 3 mm whereby more efficient heat transfer is obtained.

11. In the apparatus of claim 10 the further improvement wherein said heat exchange surface is further prepared with roughness said roughness having heights ranging from 0.0001" to 0.008" above said heat exchange surface whereby the viscous sublayer may be broken up.

12. In the apparatus of claim 10 the further improvement whereby the inside surface of said cavities are prepared with micro cavities the dimensions of said micro cavities being in the range of 1×

10^-2 mm to 1×

10^-4 mm.

13. In the apparatus of claim 4 the further improvement wherein said liquid coolant is introduced at approximately its boiling point.