Multi-layer plastic container

• US 4,800,129 A
• Filed: 03/26/1987
• Issued: 01/24/1989
• Est. Priority Date: 03/26/1987
• Status: Expired due to Term

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Deak, Gedeon I.
• Primary Examiner(s): HERBERT JR, THOMAS
• Application Number:
  US07/030,425
• Time in Patent Office: 670 Days
• Field of Search: 428/474.4, 428/475.2, 428/480, 428/476.1, 428/476.3, 428/475.8, 525/432, 525/66, 524/538, 264/171
• US Class Current: 428/474.4
• CPC Class Codes: B29C 51/002 characterised by the choice of material
• CPC Class Codes: B29C 51/14 using multilayered preforms or sheets
• CPC Class Codes: B29K 2077/00 Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
• CPC Class Codes: Y10T 428/31725 Of polyamide
• CPC Class Codes: Y10T 428/31736 Next to polyester
• CPC Class Codes: Y10T 428/31743 Next to addition polymer from unsaturated monomer[s]
• CPC Class Codes: Y10T 428/31746 Polymer of monoethylenically unsaturated hydrocarbon
• CPC Class Codes: Y10T 428/3175 Next to addition polymer from unsaturated monomer[s]
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]

Abstract

Thermoformed multi-layer structures comprising at least a first and a second layer, the first layer comprising a blend of amorphous polyamides having a Tg greater than about 120° C. and one or more semicrystalline aliphatic polyamide and the second layer comprising a structural thermoplastic resin.

Claims

1. A thermoformed multi-layer structure comprising at least a first and second layer, said first layer comprising a blend of 70-85% of an amorphous polyamide having a Tg greater than about 120°

C. which is a hexamethylenediamine iso/terephthalamide with a ratio of iso- to tere- phthalamide in the range of about 60/40 to 100/0, with 15-30% of one or more semicrystalline aliphatic polyamides and said second layer comprising one or more structural thermoplastic resins.

2. A thermoformed multi-layer structure of claim 1 where the blend in said first layer comprises 70% amorphous polyamide and 30% semicrystalline aliphatic polyamide.

3. A thermoformed multi-layer structure of claim 1 where said structural thermoplastic resin has a Tg of less than about 110°

C.

4. A thermoformed multi-layer structure of claim 1 where said structural thermoplastic resin is selected from polyethylene terephthalate, polystyrene, polyvinyl chloride, linear and branched polyethylenes, co- and terpolymers of ethylene with vinyl acetate acrylic acid or methacrylic acid, and ionomers obtained by partially neutralizing such acid copolymers.

5. A thermoformed multilayer structure of claim 1 in which a layer of adhesive resin is interposed between said first layer and said second layer.

6. A thermoformed multi-layer structure of claim 1 where the ratio of nitrogen to carbon atoms in said semicrystalline aliphatic polyamide is at least 0.12.

7. A thermoformed multi-layer structure of claim 6 where said semicrystalline aliphatic polyamide is selected from nylon 6, nylon 66.6, nylon 6,10 and copolymers thereof.

8. A thermoformed multi-layer structure of claim 1 where said semicrystalline aliphatic polyamide is selected from nylon-6, nylon 66.6, nylon 6,10 and copolymers thereof.

9. A thermoformed multi-layer structure of claim 8 where said thermoplastic resin is selected from polyethylene terephthalate, polyvinyl chloride, linear and branched polyethylenes, co- and terpolymers of ethylene with vinyl acetate acrylic acid or methacrylic acid, and ionomers obtained by partially neutralizing such acid copolymers.