Frostless interface supercooled VLSI system

• US 4,800,422 A
• Filed: 05/07/1987
• Issued: 01/24/1989
• Est. Priority Date: 05/07/1987
• Status: Expired due to Term

• Current Assignee: Steinmetz Electrical LLC (Intellectual Ventures LLC)
• Original Assignee: NCR Corporation (NCR Voyix Corporation)
• Inventors: Milby, Gregory H., Sanwo, Ikuo J.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US07/046,764
• Time in Patent Office: 628 Days
• Field of Search: 357/81, 357/82, 361/382, 361/385, 361/389, 165/80.5, 165/80.4, 165/104.33, 165/169
• US Class Current: 257/716
• CPC Class Codes: H01L 23/445 the fluid being a liquefied gas, e.g. in a cryogenic vessel
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A double walled vessel having a styrofoam filling between the double walls internally supports a semiconductor circuit to which is attached at least one flat ribbon cable. The semiconductor circuit is immersed in liquid nitrogen with at least one flat ribbon cable extending to the top lip of the vessel. Carbon conductors are connected to each conductor of the flat ribbon cable and extend to the outer wall of the vessel. Another flat ribbon cable is connected to the carbon conductors and to an electrical connector. A double walled top having a styrofoam filling is secured to the vessel such that the carbon conductors are sealed between the styrofoam filling of the top and the double walled vessel thereby preventing the formation of frost on the flat ribbon cable and connector that is external to the sealed vessel. Various tubings are inserted through the double walled vessel to permit the insertion of liquid nitrogen and the drawing off of gaseous nitrogen.

Claims

1. A system for supercooling a semiconductor chip comprising:

a double wall vessel;

a double wall top for sealing said double wall vessel, wherein said double wall vessel and top each have inner and outer walls and a space therebetween;

a temperature insulating material filling said space;

a semiconductor chip;

means within said vessel for supporting said semiconductor chip;

electrical conductor means connected to said semiconductor chip, said electrical conductor means extending from said semiconductor chip to the top of the inner wall of said vessel;

carbon conductors connected to said electrical conductor means from the inner wall to the outer wall of said vessel and sandwiched between said temperature insulating material of said vessel and said top;

electrical conductor means connected to said carbon conductors at the outer wall of said vessel; and

a supercooling liquid within said vessel covering said semiconductor chip.

2. A system for supercooling a semiconductor chip according to claim 1 and further comprising:

a fill opening through the double walls of said vessel for adding said supercooling liquid.

3. A system for supercooling a semiconductor chip according to claim 1 wherein said carbon conductors are discrete carbon resistors.

4. A system for supercooling a semiconductor chip according to claim 1 wherein said carbon conductors are carbon ribbon strips.

5. A system for supercooling a semiconductor chip comprising:

a vessel;

a top for sealing said vessel at a juncture between said vessel and said top;

a semiconductor chip;

mounting means for mounting said semiconductor chip in said vessel;

cabling means for electrically coupling signals from said semiconductor chip to a connector positioned outside of said vessel;

carbon conductors interposed in said cabling means at a position corresponding to said juncture; and

a supercooling liquid covering said semiconductor chip in said vessel.

6. The system for supercooling a semiconductor chip according to claim 5 wherein said carbon conductors are discrete carbon resistors.

7. The system for supercooling a semiconductor chip according to claim 5 wherein said carbon conductors are carbon ribbon strips.

8. The system for supercooling a semiconductor chip according to claim 5 wherein said semiconductor chip is a VLSI CMOS chip.

9. The system for supercooling a semiconductor chip according to claim 5 wherein said vessel and said top are lined with a styrofoam material.

10. The system for supercooling a semiconductor chip according to claim 9 wherein said styrofoam material is lined with a liner of ceramic material.

11. A system for supercooling a semiconductor chip comprising:

an insulated vessel;

a semiconductor chip;

mounting means for mounting said semiconductor chip inside said vessel;

cabling means for electrically coupling signals from said semiconductor chip to a connector positioned outside of said vessel;

thermally insulating, electrical conductors interposed in said cabling means from inside to outside said vessel; and

a supercooling liquid covering said semiconductor chip inside said vessel.