Transport container with an interchangeable inside container

• US 4,804,086 A
• Filed: 12/16/1987
• Issued: 02/14/1989
• Est. Priority Date: 12/22/1986
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Grohrock, Peter
• Primary Examiner(s): FIDEI, DAVID
• Application Number:
  US07/133,810
• Time in Patent Office: 426 Days
• Field of Search: 206/207, 206/454, 206/328, 206/334, 141/98, 414/217, 414/404, 414/417, 211/41, 220/469, 220/415, 220/371
• US Class Current: 206/710
• CPC Class Codes: H01L 21/67369 characterised by shock absorbing elements, e.g. retainers or cushions
• CPC Class Codes: H01L 21/67376 characterised by sealing arrangements
• CPC Class Codes: H01L 21/67386 characterised by the construction of the closed carrier
• CPC Class Codes: H01L 21/67393 characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10S 414/14 Wafer cassette transporting

Abstract

A transport container with an interchangeable, bipartite inside container includes an outside hood, an outside bottom plate, an inside hood, an inside bottom plate, two closing levers, a sealing element and a semiconductor holder. A filter element is built into the container to provide a particle-type transportation container for transporting and storing semiconductor wafers in a semiconductor wafer cassette and for use in differing air pressure conditions and air purity conditions.

Claims

1. A transport container for transporting and storing semiconductor wafers in a semiconductor wafer cassette, comprising:

an outside hood;

an outside bottom plate;

an inside hood;

an inside bottom plate that forms a closed inside container with said inside hood;

first and second closing levers for non-positive closing of said outside hood with said outside bottom plate;

a sealing element for air-tight closure of said transport container; and

an interchangeable semiconductor wafer holder secured to said inside hood and hingedly moveable relative to said transporting container.

2. A transporting container as claimed in claim 1, further comprising:

a filter provided in said inside bottom plate to provide a particle-free air stream into said transport container during pressure fluctuations.

3. A transport container as claimed in claim 1, further comprising:

four L-shaped elevations on said inside bottom plate for receiving the semiconductor wafer cassette.

4. A transport container as claimed in claim 1, wherein said inside bottom plate includes a U-shaped edge extending about said inside bottom plate for accepting said sealing element.

5. A transport container as claimed in claim 1, further comprising:

first and second inwardly directed nubs extending from said inside hood to which the semiconductor wafer holder is secured.

6. A transport container as claimed in claim 1, further comprising:

outwardly direct nubs extending from said inside hood to which said outside hood is secured.

7. A transport container as claimed in claim 1, further comprising:

an outwardly directed centering ring provided in a center of said inside hood.

8. A transport container as claimed in claim 1, wherein said outside hood includes depressions for securing said closing lever.

9. A transport container as claimed in claim 1, wherein said sealing element is of silicone rubber and polyethylene film.

10. A transport container as claimed in claim 9, wherein said silicone rubber sealing element has a material hardness of about 5 degrees Shore and said polyethylene film has a thickness of about 0.1 mm.

11. A transport container as claimed in claim 1, wherein said interchangeable semiconductor wafer holder includes:

first and second lateral longitudinal webs;

a reinforced center web;

a third narrow web connected by a first film hinge to said center web extending in an upward direction;

a perpendicularly disposed fourth web connected to said third narrow web by a second film hinge, said fourth web including first and second depressions for fastening to said inside hood;

fifth and sixth webs connected to said center web extending by respective film hinges in a downward direction;

a seventh web connected in a middle of said center web; and

a spacer disposed at a lower region of said semiconductor wafer holder to provide a space between said inside bottom plate and said semiconductor wafer holder.