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Negative working color proofing process comprising diazo compound and polyvinyl acetal/polyvinyl alcohol/polyvinyl acetate resin

  • US 4,808,508 A
  • Filed: 07/01/1986
  • Issued: 02/28/1989
  • Est. Priority Date: 07/01/1986
  • Status: Expired due to Term
First Claim
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1. A method for forming a colored image which comprises:

  • (A.) providing a photosensitive element which comprises, in order;

    (i) a substrate having a release surface; and

    (ii) a photosensitive layer on said release surface, which photosensitive layer comprises a light sensitive, negative working, polymeric diazonium compound;

    a resinous binder composition, which composition contains at least 20% of a resin having the general formula
    
    
    space="preserve" listing-type="equation">--A--B--C-- wherein a plurality of each of components A, B, and C occur in ordered or random sequence in the resin and wherein A is present in said resin at about 5% to about 20% by weight and comprises groups of he formula ##STR7## B is present in said resin at about 4% to about 30% by weight and comprises groups of the formula ##STR8## and C is present in said resin at about 50% to about 91% by weight and comprises acetal groups consisting of groups of the formulae ##STR9## wherein R is lower alkyl or hydrogen, and wherein said group I. is present in component C from about 75% to about 85%;

    group II. is present in component C from about 3 to about 5%; and

    group III. is present in component C from about 10% to about 22%; and

    at least one colorant; and

    (iii) an adhesive layer in direct contact with said photosensitive layer, which adhesive layer comprises a thermoplastic polymer and which adhesive layer is nontacky at room temperature, thermally activated and can be transferred at temperatures between 60°

    C. and 90°

    C.; and

    (B.) either(i) laminating said element with heat and pressure via said adhesive layer to a developer resistant receiver sheet; and

    removing said substrate by the application of peeling forces; and

    imagewise exposing said photosensitive layer to actinic radiation;

    or(ii) imagewise exposing said photosensitive layer to actinic radiation; and

    laminating said element with heat and pressure via said adhesive layer to a developer resistant receiver sheet; and

    removing said substrate by the application of peeling forces;

    or(iii) laminating said element with heat and pressure via said adhesive layer to a developer resistant receiver sheet; and

    imagewise exposing said photosensitive layer to actinic radiation; and

    removing said substrate by the application of peeling forces; and

    (C.) removing the nonexposed areas of said photosensitive layer with a suitable liquid developer, which removing is conducted at a temperature at which said adhesive layer is substantially nontacky.

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