Fine circuit pattern drawing apparatus and method
First Claim
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1. An apparatus for drawing a fine circuit pattern on a wafer, said apparatus comprising:
- a radiation beam generating head comprising means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon;
first moving means for moving said beam generating head in a first direction; and
second moving means for moving the wafer at least in a second direction, substantially perpendicular to said first direction, while holding the wafer by attraction.
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Abstract
An apparatus for drawing a fine circuit pattern on a wafer, includes a radiation beam generating head for generating and emitting radiation beams with which the wafer is to be patternwisely exposed; a first moving system for moving the beam generating head in a first direction; and a second moving system for moving the wafer at least in a second direction, substantially perpendicular to the first direction, while holding the wafer by attraction.
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Citations
10 Claims
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1. An apparatus for drawing a fine circuit pattern on a wafer, said apparatus comprising:
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a radiation beam generating head comprising means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon; first moving means for moving said beam generating head in a first direction; and second moving means for moving the wafer at least in a second direction, substantially perpendicular to said first direction, while holding the wafer by attraction. - View Dependent Claims (2)
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3. An apparatus for drawing a fine circuit pattern on a wafer, said apparatus comprising:
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a radiation beam generating head comprising means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon; fine-driving means for finely moving said beam generating head in at least one of a Y-axis direction, a Z-axis direction and a θ
-direction; andcontrol means operable to relatively align said beam generating head with the wafer.
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4. A method of adjusting a positional relation between radiation beam generating means and a wafer which has an alignment mark and which is to be exposed with radiation beams generated by and emitted from the beam generating means to draw a pattern thereon, said method comprising the steps of:
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detecting the alignment mark formed on the wafer by use of a detecting element provided on the beam generating means as a unit; and moving the beam generating means in accordance with the detection performed in said detecting step so that a predetermined positional relation is established between the beam generating means and the wafer.
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5. In a method of drawing a fine circuit pattern on a wafer by use of radiation beam generating means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon, the improved steps comprising:
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reciprocatingly moving the beam generating means while in substantially opposed relation to the wafer; and causing the beam generating means to generate and emit the radiation beams so as to expose the wafer to draw a pattern thereon, during the reciprocating movement of the beam generating means.
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6. A radiation beam generating head assembly for generating and emitting radiation beams with which a wafer is to be exposed to draw a pattern therein, said beam generating head assembly comprising:
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a base plate; means provided on said base plate for generating and emitting the radiation beams; means provided on said base plate for detecting a positional relation between said beam generating and emitting means and the wafer when the wafer is disposed in opposition to said beam generating and emitting means; and a movable member for carrying said base plate for movement relative to the wafer. - View Dependent Claims (7, 8, 9, 10)
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Specification