Fine circuit pattern drawing apparatus and method

• US 4,810,889 A
• Filed: 12/29/1986
• Issued: 03/07/1989
• Est. Priority Date: 12/27/1985
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Yokomatsu, Takao, Yamamoto, Hironori, Seki, Mitsuaki
• Primary Examiner(s): Fields, Carolyn E.
• Assistant Examiner(s): NOT, DEFINED
• Application Number:
  US06/947,035
• Time in Patent Office: 799 Days
• Field of Search: 250/492.2, 250/492.22, 250/491.1, 430/313, 356/400, 378/34
• US Class Current: 250/492.2
• CPC Class Codes: G03F 7/704 Scanned exposure beam, e.g. raster-, rotary- and vector scanning mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358
• CPC Class Codes: H01L 21/67138 Apparatus for wiring semiconductor or solid state device

Abstract

An apparatus for drawing a fine circuit pattern on a wafer, includes a radiation beam generating head for generating and emitting radiation beams with which the wafer is to be patternwisely exposed; a first moving system for moving the beam generating head in a first direction; and a second moving system for moving the wafer at least in a second direction, substantially perpendicular to the first direction, while holding the wafer by attraction.

Claims

1. An apparatus for drawing a fine circuit pattern on a wafer, said apparatus comprising:

a radiation beam generating head comprising means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon;

first moving means for moving said beam generating head in a first direction; and

second moving means for moving the wafer at least in a second direction, substantially perpendicular to said first direction, while holding the wafer by attraction.

2. An apparatus according to claim 1, wherein said first moving means includes a carriage for carrying thereon said beam generating head, and a driving element mounted on said carriage for finely moving said beam generating head.

3. An apparatus for drawing a fine circuit pattern on a wafer, said apparatus comprising:

a radiation beam generating head comprising means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon;

fine-driving means for finely moving said beam generating head in at least one of a Y-axis direction, a Z-axis direction and a θ

-direction; and

control means operable to relatively align said beam generating head with the wafer.

4. A method of adjusting a positional relation between radiation beam generating means and a wafer which has an alignment mark and which is to be exposed with radiation beams generated by and emitted from the beam generating means to draw a pattern thereon, said method comprising the steps of:

detecting the alignment mark formed on the wafer by use of a detecting element provided on the beam generating means as a unit; and

moving the beam generating means in accordance with the detection performed in said detecting step so that a predetermined positional relation is established between the beam generating means and the wafer.

5. In a method of drawing a fine circuit pattern on a wafer by use of radiation beam generating means for generating and emitting radiation beams with which the wafer is to be exposed to draw a pattern thereon, the improved steps comprising:

reciprocatingly moving the beam generating means while in substantially opposed relation to the wafer; and

causing the beam generating means to generate and emit the radiation beams so as to expose the wafer to draw a pattern thereon, during the reciprocating movement of the beam generating means.

6. A radiation beam generating head assembly for generating and emitting radiation beams with which a wafer is to be exposed to draw a pattern therein, said beam generating head assembly comprising:

a base plate;

means provided on said base plate for generating and emitting the radiation beams;

means provided on said base plate for detecting a positional relation between said beam generating and emitting means and the wafer when the wafer is disposed in opposition to said beam generating and emitting means; and

a movable member for carrying said base plate for movement relative to the wafer.

7. A radiation beam generating head system according to claim 6, wherein said detecting means includes signal outputting means and signal inputting means which are cooperable to detect a mark formed on the wafer.

8. A radiation beam generating head system according to claim 6, wherein said radiation beam generating and emitting means includes a plurality of radiation beam sources each for generating and emitting a radiation beam.

9. A radiation beam head system according to claim 6, further comprising means for adjusting an orientation relative to said movable member of said beam generating and emitting means.

10. A radiation beam generating head system according to claim 6, wherein said movable member comprises a movable carriage.